XC7Z100-1FFG900I AMD (Xilinx) Zynq-7000 SoC Dual-Core ARM Cortex-A9 444K Logic Cells 362 I/O 16 GTX 900-FBGA Industrial

Property:
Specification
Product Type:
System-on-Chip (SoC)
Brand:
AMD (formerly Xilinx)
Series:
Zynq-7000
Processor:
Dual-core ARM Cortex-A9 MPCore, up to 667MHz
Logic Cells:
444K
LUTs:
277.4K
Flip-Flops:
554.8K
Total RAM Bits:
26.5Mb Block RAM
User I/O:
362
High-Speed Transceivers:
16 GTX, up to 12.5Gbps
DSP Slices:
2020
Speed Grade:
-1
Core Voltage:
1.0V
I/O Voltage:
1.2V - 3.3V
Operating Temperature:
-40°C to +100°C (Industrial)
Package:
900-FBGA (31x31mm)

XC7Z100-1FFG900I Product Overview

The XC7Z100-1FFG900I is a System-on-Chip (SoC) from AMD (formerly Xilinx), part of the Zynq-7000 family, housed in a 900-pin FBGA (FFG900) package and manufactured using 28nm process technology. The XC7Z100-1FFG900I integrates a dual-core ARM Cortex-A9 MPCore processor (up to 667MHz, -1 speed grade) with Kintex-7 programmable logic resources, providing 444K logic cells and 26.5Mb of Block RAM, featuring 362 user I/O pins. The XC7Z100-1FFG900I incorporates 16 GTX high-speed transceivers, each running at up to 12.5Gbps, and rich interface resources including dual Gigabit Ethernet, USB 2.0, SD/SDIO, UART, SPI, I2C, and CAN, with DDR3 memory controller support. The XC7Z100-1FFG900I operates over an industrial temperature range of -40°C to +100°C with speed grade -1, delivering high-performance processing and flexible programmable logic expansion for industrial control, embedded vision, automotive electronics, and communication equipment applications. XC7Z100-1FFG900I is a versatile and dependable SoC.


XC7Z100-1FFG900I Core Features

Processor System: The XC7Z100-1FFG900I features a dual-core ARM Cortex-A9 MPCore, up to 667MHz, with NEON SIMD and double-precision floating-point unit

Programmable Logic: The XC7Z100-1FFG900I provides 444K logic cells (Kintex-7 equivalent), 277.4K LUTs, 554.8K flip-flops, 26.5Mb Block RAM

User I/O: The XC7Z100-1FFG900I offers 362 user I/O pins supporting various single-ended and differential standards

High-Speed Transceivers: The XC7Z100-1FFG900I includes 16 GTX transceivers, each up to 12.5Gbps

DSP Capability: The XC7Z100-1FFG900I delivers 2020 DSP Slices for efficient digital signal processing

Memory Interface: The XC7Z100-1FFG900I supports DDR3, DDR3L, DDR2, and LPDDR2, up to 1066Mb/s

Peripheral Interfaces: The XC7Z100-1FFG900I integrates dual Gigabit Ethernet, USB 2.0 OTG, SD/SDIO, UART, SPI, I2C, CAN

Operating Conditions: The XC7Z100-1FFG900I operates at core voltage 1.0V, I/O voltage 1.2V-3.3V, industrial -40°C to +100°C

Package: The XC7Z100-1FFG900I is housed in a 900-pin FBGA (31x31mm), surface mount, RoHS compliant

XC7Z100-1FFG900I is designed for robust performance.


XC7Z100-1FFG900I Applications

Industrial Control: XC7Z100-1FFG900I can be used in industrial Ethernet, motion control, and PLC systems for real-time data processing and communication.

Embedded Vision: XC7Z100-1FFG900I supports image sensor interfaces, image pre-processing, and feature extraction for smart cameras and machine vision.

Automotive Electronics: XC7Z100-1FFG900I is suitable for advanced driver assistance systems (ADAS), infotainment, and body control.

Communication Equipment: XC7Z100-1FFG900I is suitable for small base stations, remote radio units, and network protocol processing, with 16 GTX transceivers supporting multi-channel high-speed serial connectivity.

Medical Devices: XC7Z100-1FFG900I can be used in portable medical monitors, ultrasound imaging, and signal processing.

IoT Gateways: XC7Z100-1FFG900I integrates processor and FPGA, suitable for edge computing, protocol conversion, and data aggregation.


XC7Z100-1FFG900I Key Advantages

Processor and FPGA Integration: The XC7Z100-1FFG900I offers single-chip integration of dual-core ARM Cortex-A9 processor and Kintex-7 FPGA, reducing board space and system complexity.

Integrated High-Speed Transceivers: The XC7Z100-1FFG900I includes built-in 16 GTX transceivers at 12.5Gbps, eliminating external PHY chips for multi-channel high-speed serial communication, suitable for communications and video applications.

Rich Peripherals: The XC7Z100-1FFG900I provides built-in dual Gigabit Ethernet, USB 2.0, and other high-speed interfaces, reducing external chip requirements and BOM cost.

Flexible I/O Support: The XC7Z100-1FFG900I offers 362 user I/O pins supporting DDR3 interfaces and multiple level standards, adapting to various peripherals and bus protocols.

Mature Development Ecosystem: The XC7Z100-1FFG900I supports AMD (Xilinx) Vivado and Vitis development tools, with rich IP core resources to accelerate product development.

Industrial-Grade Reliability: The XC7Z100-1FFG900I operates over a temperature range of -40°C to +100°C, meeting demanding industrial and outdoor requirements.


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FAQ

  1. Is XC7Z100-1FFG900I an FPGA or a processor?
    • XC7Z100-1FFG900I is a Zynq-7000 series SoC that integrates a dual-core ARM Cortex-A9 processor and Kintex-7 programmable logic, offering both processor and FPGA capabilities.
  2. What is the performance of the built-in ARM processor?
    • The XC7Z100-1FFG900I integrates a dual-core ARM Cortex-A9 MPCore with a maximum frequency of 667MHz (speed grade -1), supporting NEON SIMD and double-precision floating-point operations, suitable for Linux or bare-metal applications.
  3. How large is the programmable logic portion?
    • The XC7Z100-1FFG900I provides 444K logic cells, 277.4K LUTs, 554.8K flip-flops, 26.5Mb Block RAM, and 2020 DSP Slices, suitable for large-scale logic design and signal processing.
  4. How many high-speed transceivers does this chip have? What is the rate?
    • The XC7Z100-1FFG900I integrates 16 GTX high-speed transceivers, each capable of up to 12.5Gbps, suitable for optical communications, PCIe data links, and multi-channel high-speed serial interfaces.
  5. What external memory interfaces does it support?
    • The XC7Z100-1FFG900I supports DDR3, DDR3L, DDR2, and LPDDR2 memory with data rates up to 1066Mb/s, meeting embedded system memory requirements.
  6. What interface standards do the 362 I/O pins support?
    • The XC7Z100-1FFG900I supports various single-ended and differential standards, including LVTTL, LVCMOS, SSTL, and LVDS, with I/O voltage range 1.2V to 3.3V.
  7. What high-speed peripheral interfaces does this device support?
    • The XC7Z100-1FFG900I integrates dual Gigabit Ethernet, USB 2.0 OTG, SD/SDIO, UART, SPI, I2C, CAN interfaces for industrial communication and connectivity.
  8. What tools and software are needed for development?
    • For the XC7Z100-1FFG900I, use AMD (Xilinx) Vivado for FPGA design and Vitis for software development and system integration, supporting PetaLinux and bare-metal development.
    • Hardware debugging can be performed via JTAG interface for in-circuit configuration and debugging.
  9. What does the -1 speed grade mean?
    • The XC7Z100-1FFG900I features the -1 speed grade, which is the base speed grade, providing processor frequency up to 667MHz, suitable for most industrial and commercial applications.
  10. What is the operating temperature range of this chip?
    • The XC7Z100-1FFG900I operates over an industrial temperature range of -40°C to +100°C (junction temperature), suitable for industrial automation, outdoor communication equipment, and harsh environments.