Item specifics
Description
XC7Z100-1FFG900I Product Overview
The XC7Z100-1FFG900I is a System-on-Chip (SoC) from AMD (formerly Xilinx), part of the Zynq-7000 family, housed in a 900-pin FBGA (FFG900) package and manufactured using 28nm process technology. The device integrates a dual-core ARM Cortex-A9 MPCore processor (up to 667MHz, -1 speed grade) with Kintex-7 programmable logic resources, providing 444K logic cells and 26.5Mb of Block RAM, featuring 362 user I/O pins. The chip incorporates 16 GTX high-speed transceivers, each running at up to 12.5Gbps, and rich interface resources including dual Gigabit Ethernet, USB 2.0, SD/SDIO, UART, SPI, I2C, and CAN, with DDR3 memory controller support. It operates over an industrial temperature range of -40°C to +100°C with speed grade -1, delivering high-performance processing and flexible programmable logic expansion for industrial control, embedded vision, automotive electronics, and communication equipment applications. XC7Z100-1FFG900I is a versatile and dependable SoC.
XC7Z100-1FFG900I Core Features
Processor System: Dual-core ARM Cortex-A9 MPCore, up to 667MHz, with NEON SIMD and double-precision floating-point unit
Programmable Logic: 444K logic cells (Kintex-7 equivalent), 277.4K LUTs, 554.8K flip-flops, 26.5Mb Block RAM
User I/O: 362 user I/O pins supporting various single-ended and differential standards
High-Speed Transceivers: 16 GTX transceivers, each up to 12.5Gbps
DSP Capability: 2020 DSP Slices for efficient digital signal processing
Memory Interface: Supports DDR3, DDR3L, DDR2, and LPDDR2, up to 1066Mb/s
Peripheral Interfaces: Integrated dual Gigabit Ethernet, USB 2.0 OTG, SD/SDIO, UART, SPI, I2C, CAN
Operating Conditions: Core voltage 1.0V, I/O voltage 1.2V-3.3V, industrial -40°C to +100°C
Package: 900-pin FBGA (31x31mm), surface mount, RoHS compliant
XC7Z100-1FFG900I is designed for robust performance.
XC7Z100-1FFG900I Applications
Industrial Control: XC7Z100-1FFG900I can be used in industrial Ethernet, motion control, and PLC systems for real-time data processing and communication.
Embedded Vision: XC7Z100-1FFG900I supports image sensor interfaces, image pre-processing, and feature extraction for smart cameras and machine vision.
Automotive Electronics: XC7Z100-1FFG900I is suitable for advanced driver assistance systems (ADAS), infotainment, and body control.
Communication Equipment: XC7Z100-1FFG900I is suitable for small base stations, remote radio units, and network protocol processing, with 16 GTX transceivers supporting multi-channel high-speed serial connectivity.
Medical Devices: XC7Z100-1FFG900I can be used in portable medical monitors, ultrasound imaging, and signal processing.
IoT Gateways: XC7Z100-1FFG900I integrates processor and FPGA, suitable for edge computing, protocol conversion, and data aggregation.
XC7Z100-1FFG900I Key Advantages
Processor and FPGA Integration: Single-chip integration of dual-core ARM Cortex-A9 processor and Kintex-7 FPGA reduces board space and system complexity.
Integrated High-Speed Transceivers: Built-in 16 GTX transceivers at 12.5Gbps eliminate external PHY chips for multi-channel high-speed serial communication, suitable for communications and video applications.
Rich Peripherals: Built-in dual Gigabit Ethernet, USB 2.0, and other high-speed interfaces reduce external chip requirements and BOM cost.
Flexible I/O Support: 362 user I/O pins support DDR3 interfaces and multiple level standards, adapting to various peripherals and bus protocols.
Mature Development Ecosystem: Supports AMD (Xilinx) Vivado and Vitis development tools, with rich IP core resources to accelerate product development.
Industrial-Grade Reliability: Operating temperature range of -40°C to +100°C meets demanding industrial and outdoor requirements.
Why Choose QIXINWEI
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