XC7Z045-2FBG676C AMD (Xilinx) Zynq-7000 SoC Dual-Core ARM Cortex-A9 350K Logic Cells 250 I/O 16 GTX 676-FCBGA Commercial

XC7Z045-2FBG676C Product Overview

The XC7Z045-2FBG676C is a System-on-Chip (SoC) from AMD (formerly Xilinx), part of the Zynq-7000 family, housed in a 676-pin FCBGA (FBG676) package and manufactured using 28nm process technology. The device integrates a dual-core ARM Cortex-A9 MPCore processor (up to 800MHz, -2 speed grade) with Kintex-7 programmable logic resources, providing 350K logic cells and 19.2Mb of Block RAM, featuring 250 user I/O pins. The chip incorporates 16 GTX high-speed transceivers, each running at up to 12.5Gbps, and rich interface resources including dual Gigabit Ethernet, USB 2.0, SD/SDIO, UART, SPI, I2C, and CAN, with DDR3 memory controller support. It operates over a commercial temperature range of 0°C to +85°C with speed grade -2, delivering high-performance processing and flexible programmable logic expansion for industrial control, embedded vision, automotive electronics, and communication equipment applications. XC7Z045-2FBG676C is a versatile and dependable SoC.

XC7Z045-2FBG676C Core Features

Processor System: Dual-core ARM Cortex-A9 MPCore, up to 800MHz, with NEON SIMD and double-precision floating-point unit

Programmable Logic: 350K logic cells (Kintex-7 equivalent), 218.6K LUTs, 437.2K flip-flops, 19.2Mb Block RAM

User I/O: 250 user I/O pins supporting various single-ended and differential standards

High-Speed Transceivers: 16 GTX transceivers, each up to 12.5Gbps

DSP Capability: 900 DSP Slices for efficient digital signal processing

Memory Interface: Supports DDR3, DDR3L, DDR2, and LPDDR2, up to 1066Mb/s

Peripheral Interfaces: Integrated dual Gigabit Ethernet, USB 2.0 OTG, SD/SDIO, UART, SPI, I2C, CAN

Operating Conditions: Core voltage 1.0V, I/O voltage 1.2V-3.3V, commercial 0°C to +85°C

Package: 676-pin FCBGA (27x27mm), surface mount, RoHS compliant

XC7Z045-2FBG676C is designed for robust performance.

XC7Z045-2FBG676C Applications

Industrial Control: XC7Z045-2FBG676C can be used in industrial Ethernet, motion control, and PLC systems for real-time data processing and communication.

Embedded Vision: XC7Z045-2FBG676C supports image sensor interfaces, image pre-processing, and feature extraction for smart cameras and machine vision.

Automotive Electronics: XC7Z045-2FBG676C is suitable for advanced driver assistance systems (ADAS), infotainment, and body control.

Communication Equipment: XC7Z045-2FBG676C is suitable for small base stations, remote radio units, and network protocol processing, with 16 GTX transceivers supporting multi-channel high-speed serial connectivity.

Medical Devices: XC7Z045-2FBG676C can be used in portable medical monitors, ultrasound imaging, and signal processing.

IoT Gateways: XC7Z045-2FBG676C integrates processor and FPGA, suitable for edge computing, protocol conversion, and data aggregation.

XC7Z045-2FBG676C Key Advantages

Processor and FPGA Integration: Single-chip integration of dual-core ARM Cortex-A9 processor and Kintex-7 FPGA reduces board space and system complexity.

Integrated High-Speed Transceivers: Built-in 16 GTX transceivers at 12.5Gbps eliminate external PHY chips for multi-channel high-speed serial communication, suitable for communications and video applications.

Rich Peripherals: Built-in dual Gigabit Ethernet, USB 2.0, and other high-speed interfaces reduce external chip requirements and BOM cost.

Flexible I/O Support: 250 user I/O pins support DDR3 interfaces and multiple level standards, adapting to various peripherals and bus protocols.

Mature Development Ecosystem: Supports AMD (Xilinx) Vivado and Vitis development tools, with rich IP core resources to accelerate product development.

Commercial-Grade Value: Operating temperature range of 0°C to +85°C suits most commercial and controlled-environment embedded systems.

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FAQ

1. Is XC7Z045-2FBG676C an FPGA or a processor?
   
   • XC7Z045-2FBG676C is a Zynq-7000 series SoC that integrates a dual-core ARM Cortex-A9 processor and Kintex-7 programmable logic, offering both processor and FPGA capabilities.
2. What is the performance of the built-in ARM processor?
   
   • It integrates a dual-core ARM Cortex-A9 MPCore with a maximum frequency of 800MHz (speed grade -2), supporting NEON SIMD and double-precision floating-point operations, suitable for Linux or bare-metal applications.
3. How large is the programmable logic portion?
   
   • It provides 350K logic cells, 218.6K LUTs, 437.2K flip-flops, 19.2Mb Block RAM, and 900 DSP Slices, suitable for medium-to-large scale logic design and signal processing.
4. How many high-speed transceivers does this chip have? What is the rate?
   
   • It integrates 16 GTX high-speed transceivers, each capable of up to 12.5Gbps, suitable for optical communications, PCIe data links, and multi-channel high-speed serial interfaces.
5. What external memory interfaces does it support?
   
   • It supports DDR3, DDR3L, DDR2, and LPDDR2 memory with data rates up to 1066Mb/s, meeting embedded system memory requirements.
6. What interface standards do the 250 I/O pins support?
   
   • It supports various single-ended and differential standards, including LVTTL, LVCMOS, SSTL, and LVDS, with I/O voltage range 1.2V to 3.3V.
7. What high-speed peripheral interfaces does this device support?
   
   • It integrates dual Gigabit Ethernet, USB 2.0 OTG, SD/SDIO, UART, SPI, I2C, CAN interfaces for industrial communication and connectivity.
8. What tools and software are needed for development?
   
   • Use AMD (Xilinx) Vivado for FPGA design and Vitis for software development and system integration, supporting PetaLinux and bare-metal development.
   • Hardware debugging can be performed via JTAG interface for in-circuit configuration and debugging.
9. What does the -2 speed grade mean?
   
   • The Zynq-7000 series offers -1, -2, and -3 speed grades, with -2 being the mid-range speed grade, providing processor frequency up to 800MHz, suitable for most industrial and commercial applications.
10. What is the operating temperature range of this chip?
    
    • The commercial temperature range is 0°C to +85°C (junction temperature), suitable for most commercial and controlled-environment embedded systems.