Item specifics
Description
XC7VX690T-2FFG1761I Product Overview
The XC7VX690T-2FFG1761I is a Field Programmable Gate Array (FPGA) from AMD (formerly Xilinx), part of the Virtex-7 family, housed in a 1761-pin FCBGA (FFG1761) package and manufactured using 28nm high-k metal gate (HKMG) process technology. XC7VX690T-2FFG1761I provides 693,120 logic cells and 54,150 CLBs, integrates 52,920Kbits of Block RAM, and features 850 user I/O pins. XC7VX690T-2FFG1761I incorporates 80 GTX high-speed transceivers, each running at up to 12.5Gbps, and supports PCIe 2.0/3.0 high-speed interfaces. XC7VX690T-2FFG1761I core voltage is 1.0V, with I/O voltage supporting 1.2V to 3.3V, and it operates over an industrial temperature range of -40°C to +100°C. This device uses speed grade -2, offering exceptional logic capacity, serial bandwidth, and expanded I/O capability for ultra-high-performance computing and communication applications. XC7VX690T-2FFG1761I is a versatile and dependable FPGA.
XC7VX690T-2FFG1761I Core Features
Logic Resources: XC7VX690T-2FFG1761I provides 693,120 logic cells, 54,150 CLBs, 108,300 Slices
On-Chip Memory: XC7VX690T-2FFG1761I integrates 52,920Kbits Block RAM + 10,888Kbits Distributed RAM
User I/O: XC7VX690T-2FFG1761I features 850 user I/O pins supporting various single-ended and differential standards
High-Speed Transceivers: XC7VX690T-2FFG1761I includes 80 GTX transceivers, each up to 12.5Gbps
DSP Capability: XC7VX690T-2FFG1761I contains 3,600 DSP Slices for efficient digital signal processing
Clock Management: XC7VX690T-2FFG1761I integrates MMCM and PLL units for high-precision clock synthesis
Interface Support: XC7VX690T-2FFG1761I supports PCIe 2.0/3.0 high-speed interface, DDR3 memory up to 1866Mb/s
Operating Conditions: XC7VX690T-2FFG1761I core voltage 1.0V, I/O voltage 1.2V-3.3V, industrial -40°C to +100°C
Package: XC7VX690T-2FFG1761I uses a 1761-pin FCBGA (42.5x42.5mm), surface mount, RoHS compliant
XC7VX690T-2FFG1761I is designed for robust performance.
XC7VX690T-2FFG1761I Applications
Wireless Communications: XC7VX690T-2FFG1761I can be used in 5G base stations, remote radio units, and massive MIMO systems for digital front-end processing.
Wired Communications: XC7VX690T-2FFG1761I is suitable for optical transport networks, 400G Ethernet switching, and high-speed data acquisition cards.
Video Broadcasting: XC7VX690T-2FFG1761I supports multi-channel 4K/8K video processing and broadcast-grade image enhancement.
Industrial Control: XC7VX690T-2FFG1761I can execute complex motion control algorithms, multi-axis robot controllers, and industrial Ethernet protocol processing.
Medical Imaging: XC7VX690T-2FFG1761I accelerates signal acquisition and image reconstruction in ultrasound and CT equipment.
Aerospace and Defense: XC7VX690T-2FFG1761I's industrial temperature range and reliability suit mission systems in harsh environments.
XC7VX690T-2FFG1761I Key Advantages
Ultra-High Performance: XC7VX690T-2FFG1761I with 28nm HKMG process, logic capacity reaches 693,120 logic cells, accommodating extremely complex digital system designs.
Integrated High-Speed Transceivers: XC7VX690T-2FFG1761I built-in 80 GTX transceivers at 12.5Gbps and PCIe 2.0/3.0 hard core enable large-scale multi-channel high-speed serial communication without external PHY chips.
Rich DSP Resources: XC7VX690T-2FFG1761I includes 3,600 DSP Slices efficiently executing FFT, FIR filtering, and other operations, meeting the real-time computing needs of wireless communications and image processing.
Flexible I/O Support: XC7VX690T-2FFG1761I offers 850 user I/O pins supporting DDR3 interfaces and multiple level standards, adapting to various peripherals and bus protocols, enhancing system integration flexibility.
Mature Development Ecosystem: XC7VX690T-2FFG1761I supports AMD (Xilinx) Vivado development tools and MicroBlaze soft processor, with rich IP core resources to accelerate product development.
Industrial-Grade Reliability: XC7VX690T-2FFG1761I operating temperature range of -40°C to +100°C meets the demanding requirements of industrial automation, outdoor communication equipment, and long-term deployment in harsh environments.
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