Item specifics
Description
XC7K420T-2FFG901I Product Overview
The XC7K420T-2FFG901I is a Field Programmable Gate Array (FPGA) from AMD (formerly Xilinx), part of the Kintex-7 family, housed in a 901-pin FBGA (FFG901) package and manufactured using 28nm high-k metal gate (HKMG) process technology. The device provides 416,960 logic cells and 52,120 CLBs, integrates 30,060Kbits of Block RAM, and features 500 user I/O pins. The chip incorporates 16 GTX high-speed transceivers, each running at up to 12.5Gbps, and supports PCIe 2.0 high-speed interfaces. Its core voltage is 1.0V, with I/O voltage supporting 1.2V to 3.3V, and it operates over an industrial temperature range of -40°C to +100°C. This device uses speed grade -2, offering an excellent balance between performance, power, and cost, making it suitable for high-end applications requiring ultra-high logic capacity, rich high-speed serial connectivity, and industrial-grade reliability. XC7K420T-2FFG901I is a versatile and dependable FPGA.
XC7K420T-2FFG901I Core Features
Logic Resources: XC7K420T-2FFG901I provides 416,960 logic cells, 52,120 CLBs, 104,240 Slices
On-Chip Memory: XC7K420T-2FFG901I integrates 30,060Kbits Block RAM + 6,530Kbits Distributed RAM
User I/O: XC7K420T-2FFG901I features 500 user I/O pins supporting various single-ended and differential standards
High-Speed Transceivers: XC7K420T-2FFG901I includes 16 GTX transceivers, each up to 12.5Gbps
DSP Capability: XC7K420T-2FFG901I contains 1,680 DSP Slices for efficient digital signal processing
Clock Management: XC7K420T-2FFG901I integrates MMCM and PLL units for high-precision clock synthesis
Interface Support: XC7K420T-2FFG901I supports PCIe 2.0 x8 high-speed interface, DDR3 memory up to 1866Mb/s
Operating Conditions: XC7K420T-2FFG901I core voltage 1.0V, I/O voltage 1.2V-3.3V, industrial -40°C to +100°C
Package: XC7K420T-2FFG901I uses a 901-pin FBGA (31x31mm), surface mount, RoHS compliant
XC7K420T-2FFG901I is designed for robust performance.
XC7K420T-2FFG901I Applications
Wireless Communications: XC7K420T-2FFG901I can be used in 5G base stations, remote radio units, and microwave backhaul equipment for digital front-end processing.
Wired Communications: XC7K420T-2FFG901I is suitable for optical transport networks, multi-channel protocol conversion, and high-speed data acquisition cards.
Video Broadcasting: XC7K420T-2FFG901I supports multi-channel 4K/8K video processing and broadcast-grade image enhancement.
Industrial Control: XC7K420T-2FFG901I can execute complex motion control algorithms, multi-axis robot controllers, and industrial Ethernet protocol processing.
Medical Imaging: XC7K420T-2FFG901I accelerates signal acquisition and image reconstruction in ultrasound and CT equipment.
Aerospace and Defense: XC7K420T-2FFG901I's industrial temperature range and reliability suit mission systems in harsh environments.
XC7K420T-2FFG901I Key Advantages
High Performance-per-Watt: XC7K420T-2FFG901I with 28nm HKMG process has total power 50% lower than 45nm generation, providing better power efficiency at comparable performance.
Integrated High-Speed Transceivers: XC7K420T-2FFG901I built-in 16 GTX transceivers at 12.5Gbps and PCIe 2.0 x8 hard core enable multi-channel high-speed serial communication without external PHY chips.
Rich DSP Resources: XC7K420T-2FFG901I includes 1,680 DSP Slices that efficiently execute FFT, FIR filtering, and other operations, meeting the real-time computing needs of wireless communications and image processing.
Flexible I/O Support: XC7K420T-2FFG901I offers 500 user I/O pins supporting DDR3 interfaces and multiple level standards, adapting to various peripherals and bus protocols, enhancing system integration flexibility.
Mature Development Ecosystem: XC7K420T-2FFG901I supports AMD (Xilinx) Vivado development tools and MicroBlaze soft processor, with rich IP core resources to accelerate product development.
Industrial-Grade Reliability: XC7K420T-2FFG901I operating temperature range of -40°C to +100°C meets the demanding requirements of industrial automation, outdoor communication equipment, and long-term deployment in harsh environments.
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