TMS320C6713BZDP300 TI TMS320C67x Floating-Point DSP 300MHz EMIF McASP HPI BGA-272

TMS320C6713BZDP300 Product Overview

The TMS320C6713BZDP300 is a high-performance 32-bit floating-point digital signal processor (DSP) from Texas Instruments (TI), based on the TMS320C67x core in a BGA-272 package, running at 300MHz. As the highest speed grade in the C6713 family, the TMS320C6713BZDP300 is designed for embedded applications demanding ultimate floating-point performance, integrating 264KB of on-chip SRAM (including L1 program cache, L1 data cache, and L2 unified mapped RAM/cache), along with a high-performance External Memory Interface (EMIF) that seamlessly connects to SDRAM, SRAM, and Flash memories. The TMS320C6713BZDP300 offers strong audio and communication processing capabilities: two multi-channel audio serial ports (McASP) and two multi-channel buffered serial ports (McBSP) connect directly to audio codecs and serial data streams; I2C, SPI, and a Host-Port Interface (HPI) provide flexible pathways for external control and data exchange. Leveraging the C67x core's Very Long Instruction Word (VLIW) architecture, the TMS320C6713BZDP300 delivers up to 2400 MIPS and 1800 MFLOPS of exceptional floating-point performance at 300MHz—a 50% boost over the 200MHz version and a 33% boost over the 225MHz version—making the TMS320C6713BZDP300 ideal for real-time audio processing, radar signal processing, medical imaging reconstruction, and complex industrial simulation that demand higher computational throughput.

TMS320C6713BZDP300 Core Features

Processor Core: The TMS320C6713BZDP300 features a 32-bit floating-point TMS320C67x VLIW DSP core, up to 300MHz, 2400 MIPS/1800 MFLOPS.

On-Chip Memory: The TMS320C6713BZDP300 integrates 264KB SRAM (4KB L1P cache + 4KB L1D cache + 256KB L2 unified mapped RAM/cache).

External Memory Interface (EMIF): The TMS320C6713BZDP300 supports seamless connection to 32-bit SDRAM, SRAM, Flash, and ROM.

Audio & Serial Interfaces: The TMS320C6713BZDP300 provides 2× McASP, 2× McBSP, 1× SPI, and 2× I2C interfaces.

Host Interface: The TMS320C6713BZDP300 includes a 16-bit general-purpose Host-Port Interface (HPI) for high-speed parallel data exchange with external processors/microcontrollers.

Timers & GPIO: The TMS320C6713BZDP300 has 2× 32-bit general-purpose timers and up to 16 general-purpose I/O pins.

System Management: The TMS320C6713BZDP300 features an on-chip PLL clock generator, watchdog timer, and power management module.

Power & Package: The TMS320C6713BZDP300 operates with a core voltage of 1.2V, I/O voltage of 3.3V, in a BGA-272 package, combining high performance with low power consumption.

TMS320C6713BZDP300 Applications

High-End Professional Audio: The TMS320C6713BZDP300 is used in multi-channel digital mixing consoles, broadcast-grade audio processors, and real-time effects engines.

Radar & Sonar: The TMS320C6713BZDP300 enables pulse compression, beamforming, target detection and tracking.

Medical Imaging: The TMS320C6713BZDP300 supports CT/MRI image reconstruction, ultrasound digital beamforming, and digital X-ray post-processing.

Industrial Simulation & Control: The TMS320C6713BZDP300 is suitable for real-time power electronics simulation, complex control algorithms, and hardware-in-the-loop testing.

Software-Defined Radio: The TMS320C6713BZDP300 is deployed in high-speed signal acquisition and modulation/demodulation, spectrum monitoring, and electronic warfare receivers.

TMS320C6713BZDP300 Key Advantages

Top-Tier Floating-Point Performance: The TMS320C6713BZDP300's 300MHz clock delivers 1800 MFLOPS of floating-point and 2400 MIPS of fixed-point performance—the highest in the C6713 family—comfortably handling compute-intensive tasks and significantly reducing algorithm execution time.

Rich Audio & Serial Interfaces: The TMS320C6713BZDP300 features two McASPs and two McBSPs, which can simultaneously connect multiple digital audio devices and serial peripherals, providing powerful data throughput for multi-channel audio systems.

Flexible External Memory Expansion: The TMS320C6713BZDP300's EMIF interface supports SDRAM, Flash, and other external memories, enabling easy expansion of program and data space to accommodate large-scale applications.

HPI Facilitates Multi-Processor Collaboration: The TMS320C6713BZDP300's 16-bit HPI allows an external host processor to directly access the DSP's internal memory, enabling efficient data exchange between the DSP and a host controller—ideal for heterogeneous computing architectures.

Code-Compatible, Smooth Upgrade: The TMS320C6713BZDP300 is fully code-compatible with the 200MHz and 225MHz C6713 versions, allowing direct replacement for higher performance without software modifications, protecting existing investments.

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FAQ

1. How does the TMS320C6713BZDP300 differ from the 200MHz and 225MHz C6713 versions?
   
   • The TMS320C6713BZDP300 runs at 300MHz, making it the highest-performance model in the C6713 family.
   • Floating-point performance increases to 1800 MFLOPS, and fixed-point performance to 2400 MIPS—a 50% boost over the 200MHz version and a 33% boost over the 225MHz version, thanks to the TMS320C6713BZDP300's higher clock rate.
   • All three share identical on-chip memory, peripheral interfaces, and packages, allowing direct drop-in upgrades without any hardware or software modifications.
2. What floating-point performance can be expected at 300MHz?
   
   • At 300MHz, the TMS320C6713BZDP300 delivers up to 1800 MFLOPS of single-precision floating-point performance and 2400 MIPS of instruction throughput.
   • With the VLIW architecture, the TMS320C6713BZDP300 can execute up to 8 instructions per cycle, greatly enhancing parallel processing efficiency.
3. How does this DSP compare to fixed-point DSPs like the TMS320C5505?
   
   • The TMS320C6713BZDP300 is a 32-bit floating-point DSP, excelling at high-precision, wide-dynamic-range floating-point computations, ideal for audio processing, vibration analysis, and radar signal processing where numerical accuracy is critical.
   • Fixed-point DSPs typically offer lower power consumption but require more complex programming for floating-point algorithms and have limited dynamic range. The TMS320C6713BZDP300 eliminates these floating-point scaling headaches.
4. Is the on-chip memory sufficient? How can external memory be added?
   
   • The TMS320C6713BZDP300 integrates 264KB of SRAM (L1P/L1D cache + L2 RAM), suitable for storing critical code and real-time data.
   • Through the TMS320C6713BZDP300's EMIF interface, external SDRAM (up to 512MB) and Flash can be flexibly added to meet large program and non-volatile storage needs.
5. How many audio interfaces does it have? How many audio devices can be connected?
   
   • The TMS320C6713BZDP300 provides 2 McASPs and 2 McBSPs, all capable of audio data transmission and reception.
   • A single McASP on the TMS320C6713BZDP300 can support up to 16 serial data channels, giving the system strong multi-channel audio processing capability for connecting multiple ADCs/DACs/Codecs.
6. What is the purpose of the HPI host interface? How is it used?
   
   • The 16-bit HPI allows an external processor (such as an MCU or another DSP) to directly access the internal memory of the TMS320C6713BZDP300.
   • This architecture enables efficient data sharing between a host processor and the TMS320C6713BZDP300, suitable for heterogeneous systems requiring separated "control + algorithm".
7. What tools and software are needed for development?
   
   • Use TI's free Code Composer Studio (CCS) IDE for development and debugging. The TMS320C6713BZDP300 is fully supported by CCS and TI's C67x DSP libraries.
   • Hardware debuggers such as the XDS510 or XDS560 series are recommended, supporting JTAG in-circuit programming and real-time debugging.
8. What boot modes does the chip support?
   
   • The TMS320C6713BZDP300 supports booting from external ROM/Flash (via EMIF) or from the HPI interface.
   • The boot mode is determined by the logic levels of configuration pins at reset, allowing flexible selection based on system design.
9. Is the BGA-272 package difficult to solder?
   
   • The TMS320C6713BZDP300 comes in a BGA-272 package; professional reflow soldering processes and X-ray inspection equipment are recommended to ensure soldering reliability.
   • Yield can be effectively guaranteed by following standard SMT procedures and land pattern design guidelines.
10. What are the upgrade options if I need higher floating-point DSP performance?
    
    • If you need higher performance than the TMS320C6713BZDP300, within the same family, the TMS320C672x series offers higher clock speeds and richer peripherals while maintaining code compatibility.
    • For higher parallel processing and lower power consumption, consider TI's TMS320C66x multi-core DSPs or 66AK2x heterogeneous processors.