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Description
T113-i Product Overview
The T113-i is a high-cost-performance industrial-grade multi-core heterogeneous application processor from Allwinner Technology in BGA-337 package (13×13mm), manufactured on advanced 22nm process. The chip features a unique ARM+RISC-V+DSP tri-core heterogeneous architecture, integrating a dual-core ARM Cortex-A7 processor (up to 1.2GHz), a 64-bit XuanTie C906 RISC-V processor (up to 1.008GHz), and a HiFi4 DSP (up to 600MHz). Designed for industrial control, automotive electronics, and human-machine interface applications, the T113-i supports -40°C to +85°C wide temperature operation and offers powerful video codec capabilities, rich peripheral interfaces, and flexible external DDR3 memory configuration. As Allwinner's cost-effective entry-level processor for the industrial control and automotive sectors, the T113-i is an ideal choice for industrial HMI, automotive instrument clusters, display control terminals, and more.
T113-i Core Features
Multi-Core Heterogeneous Architecture (ARM+RISC-V+DSP)： T113-i integrates a dual-core ARM Cortex-A7 main core (1.2GHz), a 64-bit XuanTie C906 RISC-V real-time core (1.008GHz), and a HiFi4 DSP (600MHz), forming an Asymmetric Multiprocessing (AMP) system. Each core is independent with dedicated memory, capable of running different tasks or collaborating efficiently, achieving perfect integration of real-time control and human-machine interaction
Industrial Grade Wide Temperature Operation： Supports -40°C to +85°C industrial grade operating temperature range, passing rigorous automotive-grade reliability tests. Delivers stable operation even in extreme high/low temperature industrial environments, meeting quality certification requirements for automotive front-loading and outdoor industrial equipment
Powerful Video Codec Capabilities： Video decoding supports H.265 4K@30fps, H.264 4K@24fps, and MPEG-1/2/4, JPEG, Xvid, Sorenson Spark up to 1080p@60fps. Video encoding supports JPEG/MJPEG up to 1080p@60fps. Integrated 2D graphics acceleration unit provides smooth graphics rendering for HMI interfaces
Flexible External DDR3 Memory： Supports external DDR2/DDR3 memory with flexible capacity options of 256MB, 512MB, or 1GB. Compared to integrated memory solutions, external memory allows capacity and cost optimization based on different application scenarios, offering greater design flexibility
Rich Display Interfaces： Integrated RGB (up to 1920×1080), dual-channel LVDS (up to 1920×1080), MIPI DSI (4 lanes, up to 1920×1200), and CVBS OUT. Supports dual-screen same display or different displays, meeting requirements for instrument cluster + central control screen dual-screen interaction
Powerful Video Input Capabilities： Supports 8-bit parallel CSI interface (1080p@30fps) and 2 channels of CVBS input (NTSC/PAL). Directly interfaces with analog cameras for reverse camera and 360° surround view applications
Rich Industrial Communication Interfaces： Provides 2 channels of CAN 2.0B (direct connection to in-vehicle networks and industrial fieldbus), 1 Gigabit Ethernet MAC (supports RGMII/RMII), up to 6 UARTs (up to 4Mbps), 3 I2C/TWI, 1 SPI, 8 PWM, 2 GPADC, meeting complex industrial expansion requirements
Flexible Boot and Storage Options： Supports booting from SD card, eMMC, NAND Flash, and SPI NOR Flash. Storage interfaces include SDIO, eMMC 5.0, and NAND Flash controller, providing diverse system deployment options
BGA-337 Package： 13×13mm BGA-337 package with 0.65mm ball pitch, suitable for high-density PCB design and high-reliability industrial applications, offering excellent signal integrity and thermal dissipation performance
Comprehensive Multimedia Audio Interfaces： Integrated Audio Codec supports 3 single-channel MIC inputs, stereo LINE IN, stereo headphone output, differential LINE OUT, plus I2S, DMIC, and SPDIF/OWA interfaces, perfectly meeting voice interaction and multimedia playback requirements
T113-i Applications
Industrial Human-Machine Interface (HMI)： Industrial PLC programmers, CNC system control panels, equipment monitoring terminals, smart manufacturing HMIs, and other industrial devices requiring graphical interaction. The T113-i, with dual-core A7 and 2D acceleration, smoothly runs complex GUI systems like Linux/QT
Automotive Instrument Clusters and In-Vehicle Infotainment： Smart instrument clusters for two/three-wheel electric vehicles, full LCD instrument clusters for passenger cars, commercial vehicle infotainment terminals, cab display and control all-in-one machines for construction machinery. T113-i supports CAN bus direct connection to BMS and motor controllers for real-time vehicle status display
360° Surround View and Reverse Camera： Automotive 360° panoramic surround view systems, reverse camera modules, construction machinery surround view assistance. T113-i supports multiple CVBS camera inputs and 1080p video decoding, enabling single-chip multi-channel video stitching and display
Industrial Automation Control： PLC controllers, industrial robot teach pendants, VFD human-machine panels, power monitoring terminals, and other industrial automation devices requiring both real-time control and human-machine interaction. The RISC-V core runs FreeRTOS bare-metal programs for real-time data acquisition and control, reducing main core load
Smart EV Charging Stations and Energy Storage： EV charging station control panels, energy storage monitoring terminals, battery swap station displays. The T113-i's wide temperature tolerance and CAN/Ethernet interfaces are perfectly suited for outdoor charging infrastructure
Smart Commercial Displays and Self-Service Terminals： Self-service vending machines, parcel lockers, self-service kiosks, digital signage, advertising machines. Supports dual-screen different display and multiple format video decoding
Smart Home Control Panels： Smart home central control screens, smart speaker displays, smart switch panels, video intercom indoor units. The T113-i's cost-effectiveness makes it ideal for consumer-grade HMI applications
Medical Display Terminals： Display control cores in medical monitors, portable ultrasound devices, rehabilitation equipment. Industrial-grade quality ensures long-term stable operation of medical devices
T113-i Key Advantages
Tri-Core Heterogeneous Architecture Breaks New Ground in Industrial Control Performance： The T113-i is one of the few industrial-grade processors featuring ARM+RISC-V+DSP tri-core heterogeneous architecture. The dual-core Cortex-A7 main core runs Linux/QT handling complex human-machine interfaces, the RISC-V real-time core handles sensor data acquisition and motor control (microsecond response), and the HiFi4 DSP specializes in audio codec and voice algorithm processing. With clear core division and heterogeneous collaboration, a single chip replaces the traditional three-chip solution (MPU+MCU+DSP), significantly reducing system complexity and BOM cost
Industrial Grade Wide Temperature and High Reliability Assurance： Supports -40°C to +85°C industrial grade wide temperature operation, manufactured on 22nm process with LFBGA packaging. Core board solutions certified for 100% domestic materials, meeting stringent requirements for reliability and long-term stability in automotive front-loading and outdoor industrial applications
Single-Chip Video Input to Display Full Chain Solution： Integrates 2-channel CVBS input, 8-bit parallel CSI, and multiple display interfaces (RGB/LVDS/MIPI/CVBS), eliminating the need for external video decoder chips or FPGAs for analog camera signal capture and display output. Particularly suited for reverse camera and 360° surround view applications, reducing total BOM cost by over 30%
Flexible Memory and Storage Configuration： Supports external 256MB/512MB/1GB DDR3 memory, allowing capacity selection based on project requirements - meeting high-end complex interface memory needs while offering low-cost options for budget-sensitive designs. Multiple boot media support (SD/eMMC/NAND/SPI NOR) provides diverse system deployment options
Exceptional Interface Integration： 2x CAN, 1x Gigabit Ethernet, 6x UART, 2x USB, 3x I2C, 8x PWM, and more rich interfaces eliminate the need for external bus or I/O expansion chips for most industrial equipment peripheral connection requirements, greatly simplifying PCB layout
Complete Software Ecosystem with Mainline Kernel Support： T113-i has official support in mainline Linux kernel and U-Boot. Allwinner provides complete Linux BSP and SDK. Third-party vendors like MYIR, Forlinx, and ALIENTEK offer mature industrial-grade core boards and development kits, lowering software development and debugging barriers and accelerating time-to-market
AMP Heterogeneous Multi-Processing Architecture Unites Real-Time Response and Complex Interfaces： OpenAMP framework enables inter-core communication, with main core running Linux coordinating with secondary cores running RTOS/bare-metal programs. The RISC-V core can share main core interrupt handling tasks, achieving microsecond-level real-time response. This architecture is particularly suited for industrial equipment requiring both complex graphical interfaces and high real-time control handling
100% Domestic Material Certification： The T113-i and supporting core boards have passed authoritative CEPREI certification with 100% domestic materials, achieving a self-sufficient supply chain. This provides significant advantages for industrial control, power, and automotive projects with strict localization requirements, reducing dependency risks on overseas chips
Proven Mass Production Solutions： T113-i has been widely deployed in volume production across electric vehicle instrument clusters, construction machinery surround view, charging station HMI, and other applications. The BGA-337 package's excellent thermal performance supports fanless passive cooling designs, suitable for enclosed spaces and products requiring high dust/water resistance ratings
Excellent Cost-Performance Ratio： Among industrial-grade processors with comparable performance, the T113-i offers highly competitive pricing. Single-chip integration of tri-core heterogeneous architecture and over 20 peripheral interfaces eliminates the need for additional companion chips to build a complete system, significantly reducing total BOM cost compared to similar solutions
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FAQ:
What is the Allwinner T113-i and its key specifications?
The T113‑i is a multi‑core heterogeneous industrial processor from Allwinner. It integrates a dual‑core ARM Cortex‑A7 (up to 1.2 GHz), a RISC‑V core for real‑time/low‑power tasks, and a HiFi4 DSP for audio and signal processing. The chip includes 128 MB or 256 MB of on‑package DDR3 memory and is housed in a BGA‑337 package (approximately 14 mm × 14 mm). It supports ‑40 °C to +85 °C industrial temperature range and features interfaces such as RGB/LVDS/MIPI‑DSI for displays, MIPI‑CSI/DVP for cameras, 10/100 M Ethernet, CAN, USB 2.0, and multiple UART/SPI/I2C.
How does the three‑core heterogeneous architecture of the T113‑i work?
The T113‑i uses a unique triple‑core design: the dual‑core ARM Cortex‑A7 runs a rich operating system such as Linux, handling the main application logic, networking, and user interface. The RISC‑V core (typically clocked at 200 MHz) operates independently, running a bare‑metal or RTOS firmware for real‑time sensor fusion, power management, or always‑on wake‑word detection. The HiFi4 DSP is dedicated to audio and signal processing tasks, such as noise suppression, acoustic echo cancellation, and voice‑command pre‑processing. This separation allows each subsystem to be optimised for its specific workload, improving overall efficiency and real‑time performance.
What is the DSP in the T113‑i used for? Can it run other workloads?
The integrated Cadence Tensilica HiFi4 DSP is specifically optimised for high‑fidelity audio processing. Typical use cases include voice‑trigger detection, noise reduction (wind, road, echo), beam‑forming, and audio codec acceleration. While it can theoretically be programmed for other signal‑processing tasks (e.g., motor‑control algorithms or sensor fusion), its primary purpose and vendor‑provided SDK libraries are focused on audio. The DSP offloads the Cortex‑A7 cores, enabling low‑power, real‑time audio pipelines in smart speakers, voice panels, and industrial communication devices.
How much memory does the T113‑i have, and is it expandable?
The T113‑i integrates 128 MB or 256 MB of on‑package DDR3 memory, depending on the exact part number. This built‑in RAM eliminates external SDRAM components, significantly reducing PCB complexity, EMI, and bill‑of‑materials cost. For boot and persistent storage, the chip supports external SPI NOR/NAND Flash, eMMC, or an SD card. The on‑package memory is the primary system RAM and is not expandable via external DDR buses; if more memory is required, a different Allwinner platform with external DDR support should be considered.
What display and camera interfaces does the T113‑i support?
The T113‑i is suitable for human‑machine interface (HMI) applications thanks to its display outputs: RGB888 (up to 1920×1080), single/dual‑link LVDS, and MIPI‑DSI (4‑lane). It also supports CVBS (analogue) output. For camera input, it provides MIPI‑CSI (4‑lane) and DVP (parallel) interfaces, capable of handling sensors up to 5 megapixels. The hardware video engine handles H.264/H.265 1080p@60fps decoding and encoding, enabling smooth video playback and recording without loading the Cortex‑A7 cores.
What operating systems can run on the T113‑i?
The dual‑core ARM Cortex‑A7 typically runs Linux, using Allwinner’s Tina OS (a Buildroot‑based distribution) or a custom Yocto/OpenWrt build. The RISC‑V core can execute bare‑metal code or an RTOS, independently of the Linux system. Allwinner provides a comprehensive SDK that includes drivers for all peripherals, the DSP, the RISC‑V core, and the video/audio engines. This SDK is the standard development platform for building firmware on the T113‑i.
How does the T113‑i differ from the T113‑S3? Which one should I choose?
Both are T113 series chips, but the T113‑i is the industrial‑grade variant with a wider temperature range (‑40 °C to +85 °C), integrated RISC‑V and HiFi4 DSP, and typically includes a CAN bus controller. The T113‑S3 is a commercial/consumer‑grade version that usually omits the RISC‑V and DSP cores, has a narrower temperature range, and may be available in a smaller package without CAN. Choose the T113‑i when you need industrial reliability, real‑time RISC‑V processing, audio DSP, or CAN; choose the T113‑S3 for simpler, cost‑sensitive consumer products that do not require those features.
What industrial features does the T113‑i have, and can it withstand harsh environments?
It is designed from the ground up as an industrial‑grade processor. Key features include: guaranteed operation over ‑40 °C to +85 °C (sometimes +105 °C depending on the specific part number); a built‑in CAN 2.0B controller for field‑bus communication; an on‑package DDR3 for improved vibration and shock resistance; and a wide supply voltage tolerance. These characteristics make the T113‑i suitable for factory automation, outdoor EV chargers, vehicle‑mounted terminals, and building control systems where standard consumer chips would fail.
How do I program and debug the T113‑i, and what tools are needed?
Allwinner provides the Tina Linux SDK, which includes cross‑compilation toolchains for ARM Cortex‑A7 (gcc/glibc) and the RISC‑V core, plus a complete set of drivers and build scripts. The primary debug interface is a UART (serial console). The RISC‑V core is programmed separately and loaded by the Cortex‑A7 at boot time. For DSP development, Cadence Xtensa tooling is required, though pre‑compiled audio libraries are usually sufficient. A standard USB‑to‑UART adapter and a Linux development PC are the basic hardware tools needed to start developing.
What are the most typical applications for the T113‑i?
Thanks to its triple‑core design, on‑package memory, and industrial temperature rating, the T113‑i is widely used in smart industrial gateways, elevator and building control HMI panels, voice‑enabled wall panels, CAN‑bus interfaces, intelligent EV‑charging controllers, fleet‑management dashcams, and outdoor digital signage. It is particularly strong in applications that need a cost‑effective, compact Linux system with audio DSP, real‑time RISC‑V processing, and long‑term reliability.