Item specifics
Description
STM32H750VBT6 Product Overview
STM32H750VBT6 is a Cortex-M7 MCU at 480 MHz with double-precision FPU, LQFP-100. 128 KB Flash, 1 MB SRAM, LCD-TFT controller (up to XGA), Chrom-ART accelerator (DMA2D), Ethernet MAC, USB OTG HS/FS (HS requires external ULPI PHY), CAN FD, HW crypto (AES/CRYP/HASH/RNG), dual Quad SPI, FMC (SDRAM), three 16-bit ADCs (5 Msps), two 12-bit DACs, two comparators, two op-amps, advanced motor control timers, GP/LP timers, RTC, 8×USART/UART, 5×SPI/I2S, 4×I2C, SDIO, SAI, SPDIF-Rx. 80 x 5 V-tolerant I/Os. 1.62–3.6 V, -40–85 °C. Compared to the H743 series, retains the full 1 MB SRAM and hardware graphics acceleration while offering a streamlined 128 KB Flash, delivering a highly cost-effective, compact solution for high-end embedded graphics, real-time control, and industrial networking applications that execute code from external memory.
STM32H750VBT6 Core Features
Core: Cortex-M7 480 MHz, DPFPU + L1 cache (16 KB I-cache + 16 KB D-cache)
Memory: 128 KB Flash, 1 MB SRAM (incl. large DTCM and ITCM)
Graphics & Display: LCD-TFT controller (up to XGA), Chrom-ART accelerator (DMA2D)
Connectivity: Ethernet MAC, USB OTG HS/FS (HS needs external ULPI PHY), CAN FD, SDIO, SAI, SPDIF-Rx, 8×USART/UART, 5×SPI/I2S, 4×I2C
Security: Hardware AES/CRYP/HASH/RNG crypto coprocessor
Analog: 3×16-bit ADCs (5 Msps), 2×12-bit DACs, 2×Comparators, 2×Op-Amps
Motor Control: 2×Advanced Timers (PWM/Deadtime/Brake), multiple GP/LP timers
Memory Expansion: FMC (SDRAM/PSRAM/NOR/NAND), Dual Quad SPI
I/Os: 80 (5 V-tolerant)
Package: LQFP-100
Temperature Range: -40°C to 85°C
STM32H750VBT6 Applications
Compact HMI: Industrial touchscreens, small graphical dashboards, smart home panels
Real-Time Control & Networking: PLCs, servo drives, industrial Ethernet gateways
Security Systems: Secure communication nodes, data encryption terminals
Multimedia Processing: Digital audio equipment, graphical display terminals
Space-Constrained Devices: Compact embedded systems requiring high performance and graphics acceleration
STM32H750VBT6 Key Advantages
480 MHz Cortex-M7 + DPFPU: Ultimate real-time processing and floating-point performance
1 MB SRAM + Chrom-ART Acceleration: Massive buffer for smooth high-resolution display driving
Ethernet + CAN FD + HW Crypto: Single-chip for industrial networking, real-time communication, and data security
80 I/Os in Compact LQFP-100 Package: High-density integration, saves PCB space
Cost-Effective Graphics & Control Solution: Retains powerful H7 graphics and compute core, reduces overall cost when paired with external Flash
Dual Quad SPI + FMC: Flexible external code/data memory expansion
1.62–3.6 V Wide Supply: Adaptable to various power scenarios
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FAQ
1. What is STM32H750VBT6 and how does it differ from the BGA‑packaged STM32H750XBH6?
The STM32H750VBT6 is a high‑performance MCU from STMicroelectronics' STM32H7 series, built around an Arm® Cortex®‑M7 core running at up to 480 MHz in an LQFP‑100 package. It inherits the H750 family’s “small‑Flash, large‑SRAM” architecture with 128 KB on‑chip Flash and 1 MB SRAM. Compared to the BGA‑packaged XBH6, the VBT6 offers fewer I/Os (up to 82) but comes in an LQFP package that is easy to hand‑solder and visually inspect, making it ideal for prototyping, low‑volume production, and designs where simpler PCB assembly is preferred—all while retaining the same core performance, graphics accelerator, and high‑speed peripherals.
2. With only 128 KB of on‑chip Flash, how can large applications run, and is execution speed affected?
The 128 KB on‑chip Flash is intended primarily for the bootloader and security‑critical code. Large applications and graphical assets reside in external Quad SPI Flash, which can be memory‑mapped through the dual QSPI interfaces, allowing the CPU to fetch and execute instructions directly. Combined with the 1 MB multi‑bank SRAM acting as a cache, sequential read throughput is very high, and real‑world execution efficiency closely approaches that of on‑chip Flash—easily supporting complex HMIs, real‑time control, and DSP workloads.
3. How is the 1 MB on‑chip SRAM organized, and what benefits does this architecture bring for real‑time tasks?
The 1 MB SRAM is partitioned into DTCM (Data Tightly Coupled Memory), ITCM (Instruction Tightly Coupled Memory), AXI SRAM, and multiple AHB SRAM blocks. DTCM and ITCM provide zero‑wait‑state CPU access for the most demanding interrupt response and deterministic code execution. The multi‑bank design allows DMA and the CPU to access different memory regions simultaneously without blocking each other, greatly improving data throughput for tasks such as high‑speed data acquisition, image processing, and audio streaming.
4. Is the Chrom‑ART graphics accelerator available on the H750VBT6? What kind of display can it drive?
Yes, it is fully available. The built‑in Chrom‑ART (DMA2D) accelerator is dedicated to 2D graphics operations such as fills, copies, blending, and pixel‑format conversion. Paired with the on‑chip TFT‑LCD controller, it can directly drive a 24‑bit RGB display at resolutions up to 1024×768 and smoothly run complex user interfaces. Chrom‑ART handles graphics in the background, freeing the Cortex‑M7 core to focus on real‑time control and data processing—ideal for industrial HMIs, smart‑home panels, and instrumentation.
5. Besides QSPI, what external memory can the FMC interface support? Can it connect to SDRAM?
The Flexible Memory Controller (FMC) fully supports SDRAM, allowing direct connection of standard 16‑bit or 32‑bit SDRAM to expand runtime memory by tens of megabytes. FMC can also connect parallel NOR/NAND Flash. Together with the dual QSPI interfaces, the system can flexibly allocate resources between on‑chip SRAM, external SDRAM, and external non‑volatile storage to meet needs such as data logging, large graphics assets, or complex network buffers.
6. Does the chip have a hardware crypto module? How can firmware and communication security be ensured?
The STM32H750VBT6 does not include a dedicated CRYP hardware accelerator, but it does provide a true‑random‑number generator (TRNG), a Memory Protection Unit (MPU), and code readout protection (RDP). Encryption algorithms such as AES and SHA can be efficiently implemented in software using the Cortex‑M7’s DSP instructions and optimized libraries. For most IoT and industrial communication scenarios, software encryption combined with TRNG offers adequate security. If hardware‑accelerated cryptography is required, pin‑compatible models with a CRYP module are available.
7. What high‑speed communication interfaces does the chip offer? Can Ethernet, USB HS, and CAN FD be used simultaneously?
It integrates a 10/100M Ethernet MAC (with IEEE 1588 precision time protocol), a USB 2.0 OTG high‑speed controller (480 Mbps), and multiple FDCAN (Flexible Data‑Rate CAN) controllers. All of these can operate concurrently without conflicts. Both Ethernet MAC and USB HS feature dedicated DMA to significantly reduce CPU overhead, making the chip well‑suited for industrial gateways, vehicle data loggers, and distributed control systems that require multi‑protocol real‑time communication.
8. What about power consumption and thermal performance? Is the LQFP‑100 package reliable in industrial environments?
The H750VBT6 is built on a 40 nm low‑power process and typically consumes a few hundred milliwatts to around 1 W at 480 MHz full load. Although the LQFP‑100 package does not have an exposed thermal pad, effective thermal management can be achieved through proper PCB copper pours and ground plane design. The chip supports dynamic frequency scaling and multiple low‑power modes, significantly reducing power during idle periods. It is rated for the commercial temperature range (0 °C–85 °C), and with good thermal design, stable long‑term operation can be maintained within that range.
9. What software tools are needed to develop for the STM32H750VBT6, and is it compatible with the existing STM32 ecosystem?
It is fully compatible with the STM32Cube ecosystem, including the free STM32CubeMX graphical configuration tool, STM32CubeIDE integrated development environment, and the feature‑rich STM32CubeH7 firmware package. When migrating from STM32F4 or F7, a large portion of HAL code can be reused; the main adjustments involve peripheral configuration and external memory initialization. Extensive example projects covering Ethernet, USB, graphics, and more are provided to accelerate development.
10. If I later need more on‑chip Flash or hardware crypto acceleration, what upgrade options are available?
If the 128 KB on‑chip Flash is insufficient or hardware‑accelerated cryptography and hashing are required, you can upgrade to the pin‑compatible STM32H753VIT6. The H753 provides up to 2 MB of on‑chip Flash and a complete CRYP hardware accelerator, while retaining the same 1 MB SRAM and all high‑performance peripherals. Because the hardware and software ecosystems are fully compatible, upgrading requires virtually no PCB design changes and code migration is straightforward.