STM32H743VGT6 ST Mainstream Arm Cortex-M7 High-Performance 32-bit MCU 2MB Flash 1MB SRAM LCD-TFT Chrom-ART JPEG CAN FD USB OTG Ethernet Crypto LQFP-100

Property:
Specification
Product Type:
Arm Cortex-M7 High-Performance 32-bit MCU
Brand:
STMicroelectronics
Core:
Cortex-M7 480 MHz (Double-Precision FPU)
Package:
LQFP-100
Memory:
2 MB Flash, 1 MB SRAM
Graphics & Multimedia:
LCD-TFT, Chrom-ART, HW JPEG
Connectivity:
Ethernet, USB OTG HS/FS, CAN FD
Security:
AES/CRYP/HASH/RNG
Analog:
3×16-bit ADCs, 2×12-bit DACs, 2×Op-Amps, 2×Comparators
I/Os:
80
Voltage:
1.62V–3.6V
Temperature:
-40°C to 85°C

STM32H743VGT6 Product Overview

STM32H743VGT6 is a Cortex-M7 MCU at 480 MHz with double-precision FPU, LQFP-100. 2 MB dual-bank Flash, 1 MB SRAM, LCD-TFT controller (up to XGA), Chrom-ART accelerator (DMA2D), hardware JPEG codec, Ethernet MAC, USB OTG HS/FS (HS requires external ULPI PHY), CAN FD, HW crypto (AES/CRYP/HASH/RNG), dual Quad SPI, FMC (SDRAM), three 16-bit ADCs (5 Msps, 16 ch), two 12-bit DACs, two comparators, two op-amps, advanced motor control timers, GP/LP timers, RTC, 8×USART/UART, 5×SPI/I2S, 4×I2C, SDIO, SAI, SPDIF-Rx. 80 x 5 V-tolerant I/Os. 1.62–3.6 V, -40–85 °C. Compared to larger H743BIT6/IIT6 packages, this 100-pin device integrates the full 2 MB Flash, 1 MB SRAM, graphics, security, and networking features in a compact footprint, making it ideal for space-constrained high-end HMI, real-time control, and industrial networking applications.


STM32H743VGT6 Core Features

Core: Cortex-M7 480 MHz, DPFPU + L1 cache (16 KB I-cache + 16 KB D-cache)

Memory: 2 MB Dual-Bank Flash, 1 MB SRAM (incl. large DTCM and ITCM)

Graphics & Multimedia: LCD-TFT controller (up to XGA), Chrom-ART accelerator (DMA2D), HW JPEG codec

Connectivity: Ethernet MAC, USB OTG HS/FS (HS needs external ULPI PHY), CAN FD, SDIO, SAI, SPDIF-Rx, 8×USART/UART, 5×SPI/I2S, 4×I2C

Security: Hardware AES/CRYP/HASH/RNG crypto coprocessor

Analog: 3×16-bit ADCs (5 Msps, 16 ch), 2×12-bit DACs, 2×Comparators, 2×Op-Amps

Motor Control: 2×Advanced Timers (PWM/Deadtime/Brake), multiple GP/LP timers

Memory Expansion: FMC (SDRAM/PSRAM/NOR/NAND), Dual Quad SPI

I/Os: 80 (5 V-tolerant)

Package: LQFP-100

Temperature Range: -40°C to 85°C


STM32H743VGT6 Applications

Compact HMI: Industrial touchscreens, small graphical dashboards, smart home panels

Real-Time Control & Networking: PLCs, servo drives, industrial Ethernet gateways

Security Systems: Secure communication nodes, data encryption terminals

Multimedia Processing: JPEG image processing, digital audio equipment

Space-Constrained Devices: High-performance handheld devices, portable medical instruments, precision data acquisition


STM32H743VGT6 Key Advantages

480 MHz Cortex-M7 + DPFPU: Ultimate real-time processing and floating-point performance

2 MB Flash + 1 MB SRAM: Massive storage for complex code and large data buffers

LCD-TFT + Chrom-ART + JPEG: Full hardware graphics and image acceleration for smooth displays and fast image processing

Ethernet + CAN FD + HW Crypto: Single-chip for industrial networking, real-time communication, and data security

80 I/Os in Compact LQFP-100 Package: No compromise on performance, minimal footprint

Dual Quad SPI + FMC: Flexible external memory expansion

1.62–3.6 V Wide Supply: Adaptable to various power scenarios


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FAQ

1. What is the difference between STM32H743VGT6 and STM32H743VIT6, and how do I choose based on Flash size?
Both share the same LQFP‑100 package, pinout, peripherals, and 1 MB SRAM. The only difference is on‑chip Flash capacity: VGT6 has 1 MB, while VIT6 has 2 MB. If your firmware, graphics assets, and file system fit within 1 MB, the VGT6 delivers identical performance and functionality at a lower cost; if you need larger program space or plan for future expansion, the VIT6 provides double the storage headroom.

2. Is the LQFP‑100 package easy to solder? Is it suitable for hand assembly and low‑volume production?
Very easy. The LQFP‑100 has all pins exposed with a 0.5 mm pitch, allowing drag‑soldering with a standard iron and flux—no hot‑air station required. This greatly lowers the barrier for hobbyists, students, and small teams for prototyping and small‑batch production, providing ample peripheral interfaces while maintaining a compact footprint.

3. Is the 1 MB on‑chip Flash sufficient, and does it support a dual‑bank architecture?
1 MB of Flash is enough to accommodate a large RTOS, graphics libraries (such as TouchGFX), file systems, and communication stacks—sufficient for the vast majority of high‑end embedded applications. This Flash also supports a dual‑bank architecture, allowing code execution from one bank while the other is erased and written, making over‑the‑air (OTA) firmware updates safe and convenient. If your application genuinely requires more than 1 MB, the 2‑MB H743VIT6 is available.

4. What kind of applications can the 480 MHz Cortex‑M7 with 1 MB SRAM run?
With 1027 DMIPS of processing power and 1 MB of zero‑wait‑state SRAM, it can simultaneously run complex real‑time control (e.g., motor FOC), digital signal processing (e.g., FIR/FFT), a graphical user interface (accelerated by Chrom‑ART), and multi‑protocol communication (Ethernet, USB, CAN FD) on a single chip. Typical applications include industrial HMIs, medical monitors, smart‑home control panels, and high‑performance drone flight controllers.

5. Is the Chrom‑ART graphics accelerator available on the VGT6? What size display can it drive?
Fully available. The built‑in Chrom‑ART (DMA2D) hardware accelerator handles 2D graphics operations such as fills, copies, blending, and pixel‑format conversion. Together with the on‑chip TFT‑LCD controller, it can directly drive a 24‑bit RGB display at resolutions up to 1024×768, running complex user interfaces smoothly. Chrom‑ART processes graphics in the background, freeing the Cortex‑M7 core for real‑time control and data processing.

6. What hardware security features does it include? Does it support secure boot?
The H743VGT6 integrates a full set of hardware security modules, including a true‑random‑number generator (TRNG), AES‑256, SHA‑1/SHA‑2, and HMAC hardware accelerators. It also supports secure boot from external Flash, and together with code readout protection (RDP) and a Memory Protection Unit (MPU), it can establish a complete chain of trust from silicon to application, protecting firmware from unauthorized access or tampering.

7. What external memory types can be connected via the FMC and dual QSPI interfaces?
The Flexible Memory Controller (FMC) supports standard SDRAM and parallel NOR/NAND Flash, easily expanding runtime memory by tens of megabytes. The dual Quad SPI interfaces support high‑speed NOR Flash or HyperRAM at up to 200 MHz DDR mode. These interfaces do not conflict, allowing you to simultaneously use external SDRAM for data buffering and QSPI Flash for code and graphics storage—creating a highly flexible memory architecture.

8. What high‑speed communication interfaces does the chip offer? Can Ethernet, USB HS, and CAN FD be used concurrently?
It integrates a 10/100M Ethernet MAC (with IEEE 1588), a USB 2.0 OTG high‑speed controller (480 Mbps), and up to three FDCAN controllers. All of these can operate simultaneously without conflicts. Both the Ethernet MAC and USB HS feature dedicated DMA to significantly reduce CPU overhead. The LQFP‑100 package provides 82 I/Os, and with careful pin‑multiplexing planning, all these high‑speed interfaces can be brought out concurrently.

9. What about power consumption and thermal performance? Is it reliable in industrial environments?
The H743 is built on a 40 nm low‑power process and typically consumes around 1 W at 480 MHz full load. Although the LQFP‑100 package lacks an exposed thermal pad, adequate heat dissipation can be achieved through proper PCB copper pours and ground plane design. The chip supports dynamic frequency scaling and multiple low‑power modes, significantly reducing power during idle periods. It is rated for the commercial temperature range (0 °C–85 °C), and with good thermal design, long‑term stable operation can be maintained.

10. What software tools are needed to develop for the STM32H743VGT6, and is it compatible with previous STM32 ecosystems?
It is fully compatible with the STM32Cube ecosystem, including the free STM32CubeMX graphical configuration tool, STM32CubeIDE integrated development environment, and the feature‑rich STM32CubeH7 firmware package. When migrating from STM32F4 or F7, a large portion of HAL code can be reused. Extensive example projects and middleware covering Ethernet, USB, graphics, and more are provided to accelerate project development.