Item specifics
Description
STM32H735ZGT6 Product Overview
STM32H735ZGT6 is a Cortex-M7 MCU at 550 MHz with double-precision FPU, LQFP-144. 1 MB dual-bank Flash, 564 KB SRAM, LCD-TFT controller (up to XGA), Chrom-ART accelerator (DMA2D), USB OTG HS/FS (on-chip HS PHY), Ethernet MAC, CAN FD, HW crypto (AES/PKA/RNG/HASH), dual Quad SPI, FMC (SDRAM), three 16-bit ADCs (5 Msps, 24 ch), two 12-bit DACs, two comparators, two op-amps, advanced motor control timers, GP/LP timers, RTC, 8×USART/UART, 5×SPI/I2S, 4×I2C, SDIO, SAI, SPDIF-Rx. 114 x 5 V-tolerant I/Os. 1.71–3.6 V, -40–85 °C. Compared to the H723 series, adds an LCD-TFT controller, Chrom-ART graphics accelerator, and HW crypto engine, making it ideal for high-resolution graphics display, real-time control, and secure networking.
STM32H735ZGT6 Core Features
Core: Cortex-M7 550 MHz, DPFPU + L1 cache (16 KB I-cache + 16 KB D-cache)
Memory: 1 MB Dual-Bank Flash, 564 KB SRAM (incl. 128 KB DTCM)
Graphics & Display: LCD-TFT controller (up to XGA), Chrom-ART accelerator (DMA2D)
Connectivity: Ethernet MAC, USB OTG HS/FS (on-chip HS PHY), CAN FD, SDIO, SAI, SPDIF-Rx, 8×USART/UART, 5×SPI/I2S, 4×I2C
Security: Hardware AES/PKA/RNG/HASH crypto coprocessor
Analog: 3×16-bit ADCs (5 Msps, 24 ch), 2×12-bit DACs, 2×Comparators, 2×Op-Amps
Motor Control: 2×Advanced Timers (PWM/Deadtime/Brake), multiple GP/LP timers
Memory Expansion: FMC (SDRAM/PSRAM/NOR/NAND), Dual Quad SPI
I/Os: 114 (5 V-tolerant)
Package: LQFP-144
Temperature Range: -40°C to 85°C
STM32H735ZGT6 Applications
Industrial HMI: Industrial graphical display panels, touchscreen controllers
Real-Time Control & Networking: PLCs, servo drives, industrial Ethernet gateways
Security Systems: Secure communication nodes, data encryption terminals
Audio & Consumer: Digital audio equipment, advanced consumer electronics
Portable Medical & Instrumentation: High-performance handheld devices, precision data acquisition
STM32H735ZGT6 Key Advantages
550 MHz Cortex-M7 + DPFPU: Ultimate real-time processing and floating-point performance
LCD-TFT + Chrom-ART: Hardware graphics acceleration for smooth high-resolution display driving
On-Chip USB HS PHY: Eliminates external HS PHY, simplifying design and BOM
Ethernet + CAN FD + HW Crypto: Single-chip for industrial networking, real-time communication, and data security
1 MB Dual-Bank Flash + 564 KB SRAM: Large storage for safe firmware updates and complex graphics buffering
114 I/Os + 24 ADC Channels: Rich pin and analog acquisition resources for complex system integration
Dual Quad SPI + FMC: Flexible external memory expansion
1.71–3.6 V Wide Supply: Adaptable to various power scenarios
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FAQ
1. The Cortex‑M7 core on the STM32H735ZGT6 runs at up to 550 MHz. How much performance improvement does this represent over the 480 MHz STM32H743?
Built around a Cortex‑M7 core with double‑precision FPU and DSP extensions, it achieves approximately 1178 DMIPS and 2778 CoreMark at 550 MHz. Compared to the 480 MHz STM32H743, theoretical performance improves by about 15%. More importantly, it uses an advanced 40 nm process and an optimized memory architecture to boost frequency while maintaining power efficiency. Combined with 1 MB dual‑bank Flash and 564 KB SRAM, the H735 can simultaneously handle complex real‑time control, DSP, and Chrom‑ART‑accelerated graphics on a single chip.
2. How is the 564 KB SRAM organized, and is it sufficient compared to the 1 MB in the H743?
The 564 KB SRAM is carefully partitioned into: 128 KB DTCM (Data Tightly Coupled Memory), 64 KB ITCM (Instruction Tightly Coupled Memory), 256 KB AXI SRAM, and 128 KB low‑power SRAM (retained in Stop mode). DTCM and ITCM provide zero‑wait‑state CPU access for the lowest possible latency in real‑time tasks. While the total capacity is less than the H743's 1 MB, 564 KB is more than ample for the vast majority of real‑time control and graphics applications that do not require huge data buffers, and the well‑planned partitioning helps avoid bus contention and improves effective throughput.
3. Is the Chrom‑ART accelerator fully featured on the H735, and what kind of display can it drive?
Yes, it includes the full Chrom‑ART (DMA2D) hardware accelerator for 2D graphics operations such as fills, copies, blending, and pixel‑format conversion. Together with the on‑chip TFT‑LCD controller (LTDC), it can directly drive a 24‑bit RGB display at resolutions up to 1024×768, smoothly running graphics libraries like TouchGFX. Chrom‑ART offloads graphics tasks to the background, freeing the Cortex‑M7 core to focus on real‑time control—making it ideal for high‑end industrial HMIs, smart‑home panels, and medical device interfaces.
4. Does the 1 MB dual‑bank Flash support OTA updates? How can safe firmware updates be implemented?
Fully supported. The dual‑bank architecture allows code execution from one bank while the other is erased and written. After a new firmware image is downloaded to the alternate bank and its integrity verified via checksums and digital signatures, a simple boot‑address switch completes the update. If a power loss or verification failure occurs during the update, the system automatically rolls back to the original firmware, guaranteeing the device is never “bricked.” This mechanism is critical for industrial IoT gateways, medical equipment, and infrastructure nodes that require 24/7 uptime.
5. How does the STM32H735 differ from the STM32H750? How should I choose based on peripheral and memory requirements?
The H735 is an upgrade over the H723/H733, featuring 1 MB on‑chip Flash, 564 KB SRAM, and a richer peripheral set including an Ethernet MAC, USB HS, CAN FD, Chrom‑ART, and LTDC. The H750 uses a “small‑Flash, large‑SRAM” architecture with only 128 KB on‑chip Flash but 1 MB SRAM, relying on external QSPI Flash for the main application. If you need a self‑contained, secure single‑chip solution with firmware within 1 MB, the H735 is the better choice. If you require massive SRAM for data buffering and are comfortable executing code from external Flash, the H750 is ideal.
6. What high‑speed communication interfaces does the chip offer? Can Ethernet, USB HS, and CAN FD be used concurrently?
It integrates a 10/100M Ethernet MAC (with IEEE 1588), a USB 2.0 OTG high‑speed controller (480 Mbps), and up to three FDCAN controllers. All of these can operate simultaneously without conflicts. Both Ethernet MAC and USB HS feature dedicated DMA to significantly reduce CPU overhead. The LQFP‑144 package provides 114 I/Os—enough to simultaneously bring out Ethernet RMII, USB HS ULPI, and multiple CAN FD channels while leaving sufficient GPIOs for other peripherals, making it an excellent fit for multi‑protocol industrial gateways and vehicle communication.
7. What hardware security features does it include? Is secure boot supported?
The H735 includes a hardware true‑random‑number generator (TRNG), an AES‑256 encryption accelerator, and SHA‑1/SHA‑2 and HMAC hashing accelerators for efficient encryption and authentication. It also supports secure boot from external Flash, and together with code readout protection (RDP) and a Memory Protection Unit (MPU), it can establish a complete chain of trust from silicon to application, protecting firmware from unauthorized access or tampering. This is especially important for payment terminals, IoT security gateways, and industrial controllers where IP protection is essential.
8. What external memory types can be connected via the FMC and dual QSPI interfaces? Is SDRAM supported?
The Flexible Memory Controller (FMC) fully supports standard SDRAM, allowing up to 256 MB of runtime memory expansion, and can also interface with parallel NOR/NAND Flash. The dual Quad SPI interfaces support memory‑mapped mode and can connect high‑speed NOR Flash (up to 512 Mbit) or HyperRAM for code, graphics assets, and file systems. It is recommended to keep latency‑critical code and data in on‑chip SRAM while placing large graphics resources, logs, and redundant firmware in external memory for an optimal balance of performance and capacity.
9. How should power and thermal management be handled at 550 MHz full load? Is the LQFP‑144 package reliable?
Typical power consumption at 550 MHz full load is around 1–1.5 W. The LQFP‑144 package has no exposed thermal pad, but effective heat dissipation can be achieved through proper PCB design—using large ground copper pours beneath the chip, multi‑layer boards, and sufficient thermal vias—without an external heatsink. The chip supports dynamic frequency scaling and multiple low‑power modes (Sleep, Stop, Standby) to significantly reduce power during idle periods. It is rated for the commercial temperature range (0 °C–85 °C) and, with good thermal design, can operate reliably over the long term.
10. Is the software toolchain for the STM32H735ZGT6 mature? Can I reuse code from previous STM32F4/F7 projects?
Very mature. It is fully compatible with the STM32Cube ecosystem, including the free STM32CubeMX graphical configuration tool, STM32CubeIDE integrated development environment, and the feature‑rich STM32CubeH7 firmware package. If you have previously developed on STM32F4 or F7, a large portion of HAL code can be reused, with the main adjustments being peripheral configuration and memory mapping. ST also provides extensive example projects and middleware covering Ethernet, USB, graphics, and file systems to help jump‑start development.