Item specifics
Description
STM32H730VBT6 Product Overview
STM32H730VBT6 is a Cortex-M7 MCU at 550 MHz with double-precision FPU, LQFP-100. 128 KB Flash, 564 KB SRAM, USB OTG HS/FS (on-chip HS PHY), Ethernet MAC, CAN FD, dual Quad SPI, FMC (SDRAM), three 16-bit ADCs (5 Msps), two 12-bit DACs, two comparators, two op-amps, advanced motor control timers, GP/LP timers, RTC, 8×USART/UART, 5×SPI/I2S, 4×I2C, SDIO, SAI, SPDIF-Rx. 80 x 5 V-tolerant I/Os. 1.71–3.6 V, -40–85 °C. A cost-optimized variant of the H723 series, it retains the 550 MHz core, large 564 KB SRAM, and rich peripherals while offering a smaller Flash footprint, making it an attractive choice for high-performance embedded and industrial applications that execute code from external memory.
STM32H730VBT6 Core Features
Core: Cortex-M7 550 MHz, DPFPU + L1 cache (16 KB I-cache + 16 KB D-cache)
Memory: 128 KB Flash, 564 KB SRAM (incl. 128 KB DTCM)
Connectivity: Ethernet MAC, USB OTG HS/FS (on-chip HS PHY), CAN FD, SDIO, SAI, SPDIF-Rx, 8×USART/UART, 5×SPI/I2S, 4×I2C
Analog: 3×16-bit ADCs (5 Msps), 2×12-bit DACs, 2×Comparators, 2×Op-Amps
Motor Control: 2×Advanced Timers (PWM/Deadtime/Brake), multiple GP/LP timers
Memory Expansion: FMC (SDRAM/PSRAM/NOR/NAND), Dual Quad SPI
I/Os: 80 (5 V-tolerant)
Package: LQFP-100
Temperature Range: -40°C to 85°C
STM32H730VBT6 Applications
Industrial Control: Real-time controllers, PLCs, servo drives, industrial Ethernet gateways
High-Speed Communication: Ethernet/CAN FD/USB HS interface conversion and bridging
Audio & Consumer: Digital audio equipment, advanced consumer electronics
Motor Control: High-precision FOC, multi-axis servo control
Portable Medical & Instrumentation: High-performance handheld devices, precision data acquisition
STM32H730VBT6 Key Advantages
550 MHz Cortex-M7 + DPFPU: Ultimate real-time performance, outperforming peers
564 KB Large SRAM: Same massive RAM as high-end H723 models, ideal for data-intensive applications
On-Chip USB HS PHY: Eliminates external HS PHY, simplifying design and reducing BOM
Ethernet + CAN FD + Rich Connectivity: Single-chip for industrial networking and real-time communication
Dual Quad SPI + FMC: Flexible external code/data memory expansion to complement internal Flash
80 I/Os in Compact 100-Pin Package: High density, saves PCB space
1.71–3.6 V Wide Supply: Adaptable to various power environments
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FAQ
1. How does the STM32H730VBT6 differ from the STM32H750VBT6, and why would I choose it?
Both share the same LQFP‑100 package and 128 KB on‑chip Flash, relying on external QSPI Flash for code execution. The key differences are the core frequency and SRAM: the H730’s Cortex‑M7 runs at 550 MHz (vs. 480 MHz on the H750), offering higher computational performance. Its SRAM is 564 KB (vs. 1 MB on the H750) but is more finely partitioned—128 KB DTCM + 64 KB ITCM + 256 KB AXI SRAM + 128 KB low‑power SRAM—providing more deterministic low‑latency access for real‑time tasks. If your application demands maximum real‑time computation and interrupt response, and memory usage can be carefully optimized, the H730 is the superior choice.
2. With only 128 KB on‑chip Flash, how are large applications executed, and is performance affected?
The 128 KB on‑chip Flash is used primarily for boot and secure loader functions. The main application, graphics assets, and file systems reside in external QSPI Flash, which can be memory‑mapped via the dual QSPI interfaces, allowing the CPU to fetch instructions directly. Combined with the 564 KB multi‑bank SRAM acting as a cache, sequential read throughput is very high, and real‑world execution efficiency closely approaches that of on‑chip Flash—easily supporting complex HMIs, real‑time control, and signal processing tasks.
3. How is the 564 KB SRAM organized, and what practical benefits does it bring for high‑speed real‑time control?
It is divided into 128 KB DTCM (Data Tightly Coupled Memory), 64 KB ITCM (Instruction Tightly Coupled Memory), 256 KB AXI SRAM, and 128 KB low‑power SRAM (retainable in Stop mode). DTCM and ITCM provide zero‑wait‑state CPU access for the lowest possible interrupt and control‑loop latency. The multi‑bank architecture allows DMA and the CPU to access different regions simultaneously without blocking, significantly improving throughput when handling Ethernet, LCD refresh, high‑speed ADC, and motor control concurrently.
4. Are the Chrom‑ART accelerator and LCD controller fully available on the H730VBT6? What display size can be driven?
Fully available. The Chrom‑ART (DMA2D) hardware accelerator does not consume extra I/Os. The on‑chip TFT‑LCD controller (LTDC) can bring out a 24‑bit RGB interface within the 82 I/Os of the LQFP‑100 package, directly driving displays up to 1024×768 resolution with smooth TouchGFX graphics. Careful pin planning is required; switching to 16‑bit color depth or an SPI display can free up additional GPIOs.
5. How can external memory be expanded via FMC and dual QSPI? Is SDRAM supported?
The Flexible Memory Controller (FMC) fully supports SDRAM, allowing up to 256 MB of runtime memory expansion, and can also connect parallel NOR/NAND Flash. The dual QSPI interfaces support memory‑mapped mode and can connect high‑speed NOR Flash (up to 512 Mbit) or HyperRAM for code and graphics storage. In the 100‑pin package, a 16‑bit SDRAM bus and both QSPI ports can be brought out simultaneously, meeting the storage needs of most applications.
6. What high‑speed communication interfaces does the chip offer? Can Ethernet, USB HS, and CAN FD be used concurrently?
It integrates a 10/100M Ethernet MAC (with IEEE 1588), a USB 2.0 OTG high‑speed controller (480 Mbps), and multiple FDCAN controllers. All can operate simultaneously, each with dedicated DMA to significantly reduce CPU load. With careful pin‑multiplexing within the 82 I/Os, Ethernet RMII, USB HS ULPI, and at least two CAN FD channels can be brought out together while still leaving some UARTs/SPIs for sensor connections.
7. Does the 128 KB Flash support dual‑bank and OTA updates? How can safe firmware updates be implemented?
The on‑chip 128 KB Flash is typically single‑bank, but OTA updates can be implemented using external QSPI Flash. A new firmware image is downloaded to a free area in external Flash; after verification, the bootloader switches to the new version. If an update fails, the original firmware can be restored from a backup area. This approach is mature on the H730, and combined with hardware AES and SHA accelerators, it enables equally safe and reliable firmware updates.
8. How should power and thermal management be handled at 550 MHz full load?
Typical power consumption at full load is around 1–1.5 W. The LQFP‑100 package has no exposed thermal pad, but effective heat dissipation can be achieved through a large ground copper pour under the chip, a multi‑layer board, and sufficient thermal vias—no external heatsink is required. The chip supports dynamic frequency scaling and multiple low‑power modes (Sleep, Stop, Standby), significantly reducing power during idle periods. With good thermal design, it can operate reliably over the long term within the commercial temperature range (0 °C–85 °C).
9. Is the software toolchain for the STM32H730VBT6 mature? Can I reuse code from F4/F7 projects?
Fully compatible with the STM32Cube ecosystem, including the free STM32CubeMX and STM32CubeIDE, and the comprehensive STM32CubeH7 firmware package. When migrating from STM32F4/F7, a large portion of HAL code can be reused; the main adjustments involve peripheral configuration, memory mapping, and external QSPI Flash initialization. ST also provides extensive example projects covering Ethernet, USB, graphics, and file systems for a fast start.
10. If 564 KB SRAM is insufficient, or more I/Os are needed, what upgrade paths are available?
For larger SRAM, upgrade to the pin‑compatible STM32H750VBT6 (1 MB SRAM, but 480 MHz core). For more I/Os and a larger display interface, consider the LQFP‑144 STM32H735ZGT6 (1 MB on‑chip Flash + 564 KB SRAM) or the LQFP‑176 STM32H743IIT6. All these upgrades remain within the STM32Cube ecosystem, enabling extensive code and hardware design reuse.