Item specifics
Description
E64GCYNE1ABE00 Product Overview
The SCY E64GCYNE1ABE00 is a 64GB eMMC flash storage chip, independently developed and manufactured by SCY, a well-known domestic storage chip company. The E64GCYNE1ABE00 complies with JEDEC eMMC 5.0/5.1 standards, highly integrating the MMC interface, flash memory device, and main controller into a compact BGA package. It is widely used in smartphones, tablets, smart TV boxes, set-top boxes, automotive electronics, video surveillance, industrial control, and other embedded intelligent terminal devices. SCY has been mass-producing eMMC products since 2019, expanding capacity from 8GB/16GB/32GB to 64GB/128GB. The E64GCYNE1ABE00 is a mature mass-production product in its embedded storage portfolio.
E64GCYNE1ABE00 Key Features
Large Storage Capacity: The E64GCYNE1ABE00 provides 64GB storage capacity to meet the demands of operating systems, applications, and user data.
eMMC 5.0/5.1 Standard: The E64GCYNE1ABE00 complies with JEDEC eMMC 5.0/5.1 standards, delivering fast and upgradeable performance.
Highly Integrated BGA Package: The E64GCYNE1ABE00 features a BGA package that integrates the MMC interface, flash memory device, and main controller into one.
Dual-Voltage Operation: The E64GCYNE1ABE00 supports both 1.8V and 3.3V interface voltages to accommodate different platform design requirements.
Low Host Processor Load: The E64GCYNE1ABE00 significantly reduces storage management load on the host processor, freeing CPU resources for core applications.
Broad Compatibility: The E64GCYNE1ABE00 offers strong compatibility with fast resolution of technical compatibility issues between the main controller and flash memory.
Domestically Developed: SCY possesses integrated capabilities in chip design, firmware development, packaging, testing, manufacturing, and application of the E64GCYNE1ABE00.
E64GCYNE1ABE00 Applications
The E64GCYNE1ABE00 is widely used in the following fields:
Smartphones and Tablets: The E64GCYNE1ABE00 serves as the main storage chip for mobile terminals
Smart TVs and Set-Top Boxes: The E64GCYNE1ABE00 provides system storage for home entertainment devices
Networking Products: The E64GCYNE1ABE00 is used in routers, gateways, and other network communication devices
Video Surveillance: The E64GCYNE1ABE00 enables data storage for security monitoring systems
Automotive Electronics: The E64GCYNE1ABE00 is suitable for in-vehicle infotainment systems, instrument clusters
Industrial Control: The E64GCYNE1ABE00 is used in embedded industrial control systems
Smart Wearables: The E64GCYNE1ABE00 is designed into smart watches, bands, and other wearable devices
Consumer Electronics: The E64GCYNE1ABE00 is found in e-book readers, digital cameras, voice recorders, MP3/MP4 players, etc.
E64GCYNE1ABE00 Key Advantages
Large Storage Capacity: The E64GCYNE1ABE00's 64GB capacity meets the storage demands of mainstream smart devices, easily accommodating operating systems, various applications, and user data.
High Integration Simplifies Design: The E64GCYNE1ABE00's BGA package integrates controller and flash memory, effectively simplifying customer board layouts and reducing overall solution costs and development cycles.
Mature and Stable Domestic Solution: Since SCY began mass production of eMMC in 2019, the E64GCYNE1ABE00 has been widely used in mobile phones, tablets, set-top boxes, and other fields, with proven market validation and mass production experience.
Dual-Voltage Flexibility: The E64GCYNE1ABE00 supports both 1.8V and 3.3V interface voltages for flexible adaptation to different platform designs.
Full Industry Chain Self-Sufficiency: SCY is a national high-tech enterprise and a national-level "Specialized and Sophisticated" Little Giant enterprise, with full industry chain capabilities from chip design and packaging to module manufacturing of the E64GCYNE1ABE00.
High-Yield Quality Assurance: SCY achieves an ultra-high 99.98% yield rate in BGA package encapsulation of the E64GCYNE1ABE00 using YMTC wafers.
One-Stop Storage Solutions: Products like the E64GCYNE1ABE00 cover three major application scenarios: smartphones, PCs, and servers, providing global customers with one-stop storage solutions and customized services.
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FAQ
1. What is E64GCYNE1ABE00?
The E64GCYNE1ABE00 is an eMMC storage chip from SCY. It integrates NAND flash and a controller into a single BGA package, providing a standardized storage solution for embedded systems.
2. What are the key specifications?
Key specifications of the E64GCYNE1ABE00 are as follows:
Storage Capacity: 64GB
Flash Interface: eMMC 5.1
Operating Voltage: VCC=3.3V, VCCQ=1.8V or 3.3V
Package: BGA-153 (11.5mm × 13.0mm)
3. What package does it use?
The E64GCYNE1ABE00 uses a BGA-153 (Ball Grid Array) package. This is a 153-ball FBGA package, typically measuring 11.5mm × 13.0mm.
4. What applications is it suitable for?
The E64GCYNE1ABE00 is widely used in various embedded devices, including:
Smartphones and Tablets
Set-top boxes and Smart TVs
Industrial control and IoT devices
Automotive infotainment systems
Security surveillance and Wearable devices
5. What development tools support it?
As a standard eMMC storage chip, the E64GCYNE1ABE00 requires no dedicated software tools. Host platforms have built-in eMMC controller drivers, and the system can directly recognize and manage the E64GCYNE1ABE00.
6. What is the operating temperature range?
SCY eMMC products like the E64GCYNE1ABE00 are typically available in different temperature grades:
Consumer Grade: -25°C to +85°C
Industrial Grade: -40°C to +85°C
7. What are the key features?
High Integration: The E64GCYNE1ABE00 combines flash memory and controller in a single chip, simplifying system design
Standardized Interface: The E64GCYNE1ABE00 complies with JEDEC eMMC 5.1 standards for strong compatibility
Supports Large Capacities: SCY eMMC covers capacities from 8GB to 256GB, with the E64GCYNE1ABE00 offering 64GB
Low Power Design: The E64GCYNE1ABE00 supports interface voltage of 1.8V or 3.3V
Data Protection: The E64GCYNE1ABE00 supports LDPC 3.0 ECC, wear leveling, garbage collection, etc.
8. What interfaces does it support?
Host Interface: The E64GCYNE1ABE00 complies with the eMMC 5.1 standard protocol
The E64GCYNE1ABE00 supports HS400 high-speed mode, with interface speeds up to 400MB/s
Package: 153-ball BGA
9. What are the alternative models?
SCY same-series 64GB eMMC models: E64GCYNT1ABE00
SCY same-series model: E64GCH9T1ABE00
Other brand compatible models: SDINBDG4-8G-XAT2
10. What are the design considerations?
Pin Compatibility: For the E64GCYNE1ABE00, BGA package pin definitions should be confirmed with the official datasheet
PCB Layout: High-speed signal traces require impedance matching and length control
Power Decoupling: Proper decoupling capacitors should be placed near VCC and VCCQ pins of the E64GCYNE1ABE00
Voltage Selection: The E64GCYNE1ABE00 supports VCCQ at both 1.8V and 3.3V
Temperature Grade Confirmation: Select consumer or industrial grade based on the application environment for the E64GCYNE1ABE00