Item specifics
Description
EP4CE75F23I7N Product Overview
The EP4CE75F23I7N is a high-performance Field Programmable Gate Array from Intel Altera in the Cyclone IV E series, manufactured on mature 60nm low-power CMOS process technology. The EP4CE75F23I7N features 75,408 logic elements, 4,713 CLBs, 198 embedded 18x18 multipliers, 2,810,880 bits of embedded memory, and 292 user I/O pins, with PLL output frequency up to 402MHz.
The EP4CE75F23I7N delivers exceptional cost-effectiveness and balanced resource mix. The EP4CE75F23I7N features rich general-purpose I/O interfaces and comprehensive clock management resources including PLL. This industrial-grade device supports -40°C to 100°C operation and comes in a 23×23mm 484-pin FBGA package.
The Cyclone IV E series is optimized for cost-sensitive, high-volume applications, achieving the lowest power consumption while delivering high logic density. The EP4CE75F23I7N targets cost-effective applications across wired communications, industrial control, consumer electronics, video processing, and medical equipment, making the EP4CE75F23I7N an excellent choice for budget-conscious designs.
EP4CE75F23I7N Core Features
High-Density Logic and Memory Resources： The EP4CE75F23I7N provides 75,408 logic elements, 4,713 CLBs, and a 4-input LUT architecture. With 2,810,880 bits of embedded memory, the EP4CE75F23I7N supports data buffering, image processing, and caching applications.
Digital Signal Processing： The EP4CE75F23I7N integrates 198 embedded 18x18 multipliers for FIR filters, FFT algorithms, and communications baseband processing.
Flexible I/O Interface： The EP4CE75F23I7N offers flexible I/O with 292 user I/O pins supporting 1.2V to 3.3V standards including LVTTL, LVCMOS, HSTL, SSTL, and LVDS.
Powerful Clock Management： The EP4CE75F23I7N includes integrated PLL for clock synthesis, frequency scaling, phase shifting, and jitter filtering.
Industrial Operating Temperature： The EP4CE75F23I7N operates over an industrial temperature range of -40°C to 100°C junction temperature.
Package and Process： Manufactured on a 60nm low-power CMOS process with core voltage 1.15V to 1.25V, the EP4CE75F23I7N is housed in a 23×23mm 484-pin FBGA package with 1.0mm ball pitch. The EP4CE75F23I7N is RoHS compliant. The EP4CE75F23I7N meets rigorous industry standards.
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FAQs:
1 What is the EP4CE75F23I7N chip
EP4CE75F23I7N is a cost effective FPGA from Intel's Cyclone IV E series widely used in industrial control communications and video image processing fields.
2 How much logic and memory does EP4CE75F23I7N chip contain
It contains approximately 75 thousand logic elements and integrates about 270 M9K embedded memory blocks totaling about 2 point 7 megabits of on chip storage resources.
3 What package pin count and physical size does EP4CE75F23I7N use
It adopts an FBGA 484 ball grid array package with 484 pins and features a high density package that provides abundant high speed I O interfaces.
4 What are the operating temperature range and speed grade
The I suffix denotes industrial grade with a temperature range from minus 40 degrees Celsius to plus 100 degrees Celsius. The 7 suffix indicates the speed grade which is a mid range performance level.
5 What external interfaces and protocols does EP4CE75F23I7N support
It supports LVDS differential signaling DDR2 and DDR3 external memory interfaces and various single ended I O standards facilitating high speed data exchange with external devices.
6 What application scenarios is EP4CE75F23I7N chip suitable for
With its high cost effectiveness and rich logic resources it is widely used in industrial motor control video image acquisition and processing communication base stations and high speed data acquisition systems.
7 What development environments and programming languages are supported
It is developed using the official Intel Quartus Prime suite and supports mainstream hardware description languages such as Verilog HDL and VHDL for logic design.
8 What are the power consumption and power supply requirements
Its core voltage is typically 1 point 2 volts and the IO voltage can be configured flexibly according to interface standards. Power consumption depends on logic utilization and operating frequency.
9 What are the PCB design considerations for the FBGA package
Due to the high pin density the PCB design must utilize high layer count boards with strict impedance and length matching for high speed signals and decoupling capacitors must be placed near the power pins to ensure signal integrity.
10 What firmware configuration methods does the EP4CE75F23I7N chip support
It supports multiple configuration modes including Active Serial AS Passive Serial PS and JTAG interfaces for loading the FPGA firmware bitstream.