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Description
EP4CE75F23C8N Product Overview
The EP4CE75F23C8N is a high-density, low-power FPGA from Intel's (formerly Altera) Cyclone IV E series. Built on a mature 60nm low-power process technology, the EP4CE75F23C8N achieves an excellent balance between logic resources and power consumption. It features 75,408 logic elements (LEs), approximately 2.7 Mbit of embedded memory blocks, and robust DSP processing capabilities, making the EP4CE75F23C8N well-suited for complex digital signal processing and control logic applications in industrial, communications, and consumer electronics.
The Cyclone IV E series is renowned for its high cost-effectiveness, and the EP4CE75F23C8N, as a high-density member of this family, offers an ideal solution for applications that require substantial logic resources while remaining sensitive to cost and power. The EP4CE75F23C8N supports 3.3V I/O standards, enabling direct connection with a wide range of peripheral devices and simplifying system design. Housed in a 23×23 mm 484-pin FBGA package, the EP4CE75F23C8N is a commercial-grade device that supports an operating temperature range of 0°C to 85°C.
EP4CE75F23C8N Key Features
High-Density Logic Resources: The EP4CE75F23C8N provides 75,408 logic elements (LEs) and 4,713 logic array blocks (LABs), sufficient for implementing complex digital logic systems, multi-channel data acquisition, and control protocols.
Large Embedded Memory: The EP4CE75F23C8N integrates a total of 2,745 Kbit (approximately 2.7 Mbit) of embedded RAM, organized as M9K memory blocks, suitable for data buffering, image processing, and cache applications.
Digital Signal Processing Capability: The EP4CE75F23C8N features dedicated DSP blocks that support high-performance digital signal processing, filter implementations, and FFT algorithms, efficiently handling audio, video, and communication signals.
Flexible I/O Interfaces: The EP4CE75F23C8N offers up to 426 user I/O pins (some sources cite 292 GPIOs; actual total available I/Os depend on the package), supporting various I/O standards including 3.3V, 2.5V, and 1.8V, as well as LVTTL, LVCMOS, and SSTL, enabling direct connection to diverse peripherals.
Robust Clock Management: The EP4CE75F23C8N integrates multiple PLLs (Phase-Locked Loops) providing flexible clock synthesis, multiplication/division, and phase shifting capabilities to ensure high precision and stability of the system clock.
Commercial-Grade Operating Temperature: Supports an operating temperature range of 0°C to 85°C, suitable for standard commercial environments.
Package and Process: Fabricated on a 60nm low-power CMOS process with a core voltage of 1.15V to 1.25V (typically 1.2V), the EP4CE75F23C8N offers an excellent performance-to-power ratio. The 484-pin FBGA package measures 23×23 mm and is RoHS-compliant.
EP4CE75F23C8N Application Scenarios
Industrial Automation and Motion Control: The 75K logic elements and DSP modules of the EP4CE75F23C8N are suitable for servo controllers, PLC controllers, machine vision systems, and other industrial applications with high logic density and real-time requirements.
Communications and Networking Equipment: The EP4CE75F23C8N can be used in small-cell base stations, network switches, and routers for traffic management and protocol processing, enabling packet processing and signal modulation/demodulation.
Video and Image Processing: The 2.7 Mbit block RAM and DSP modules of the EP4CE75F23C8N support multi-channel video encoding/decoding, image enhancement, and display interface conversion, suitable for security surveillance and machine vision.
Consumer Electronics: The EP4CE75F23C8N is used in embedded systems such as HD video processing, smart home devices, and drones as either a main control chip or co-processor.
Medical Equipment: The EP4CE75F23C8N is applicable for signal acquisition and processing in ultrasound devices, CT image data processing, and similar applications.
Test and Measurement Instruments: The EP4CE75F23C8N serves as the core control and data acquisition unit in testing instruments.
EP4CE75F23C8N Advantages and Highlights
75K-Class Logic Element Capacity: With 75,408 logic elements, the EP4CE75F23C8N is a high-density model in the mid-range FPGA market, capable of implementing complex logic systems and algorithms to meet the design requirements of most embedded systems.
Approximately 2.7 Mbit Embedded Memory: Abundant block RAM resources in the EP4CE75F23C8N significantly reduce dependency on external memory, particularly beneficial for packet processing, multi-channel FIFOs, and real-time image processing.
High-Performance DSP Processing: The EP4CE75F23C8N integrates dedicated DSP modules that enable parallel processing of multiple data channels, efficiently implementing algorithms such as FIR filtering and FFT.
Flexible I/O and Standard Support: The EP4CE75F23C8N supports 3.3V I/O voltage, matching common peripheral devices perfectly and simplifying system design; the abundant user I/O count ensures ample connectivity for external devices.
Low-Power 60nm Process: The EP4CE75F23C8N utilizes a 60nm process, delivering high performance while maintaining low power consumption, making it suitable for medium-complexity applications sensitive to energy usage.
Mature Software Ecosystem: The Intel Quartus Prime design suite provides a comprehensive IP core library and development tools for the EP4CE75F23C8N, supports the Nios II soft-core processor, and offers extensive development documentation, helping to shorten product development cycles.
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FAQ
1. What is EP4CE75F23C8N?
The EP4CE75F23C8N is an Intel (formerly Altera) Cyclone® IV E FPGA in a 484-pin FBGA package, with 75,408 logic elements and 292 I/O pins. The EP4CE75F23C8N features the highest logic element count in the Cyclone IV family.
2. What are the key specifications of EP4CE75F23C8N?
The EP4CE75F23C8N features 75,408 logic elements, 4,713 LABs/CLBs, 2,810,880 bits total RAM, 292 I/Os, 1.15V–1.25V operating voltage, and 0°C to 85°C temperature range.
3. What package does EP4CE75F23C8N use?
The EP4CE75F23C8N uses a 484-pin FBGA (FineLine BGA), measuring 23mm × 23mm with 1mm ball pitch.
4. What applications is EP4CE75F23C8N suitable for?
The EP4CE75F23C8N is suitable for signal intelligence and cryptography, enterprise storage and virtualization solutions, augmented and virtual reality systems, renewable energy and grid management, as well as communications equipment, industrial automation, and consumer electronics.
5. What development tools support EP4CE75F23C8N?
The EP4CE75F23C8N is supported by Intel Quartus Prime / Quartus II development software. The Excel-based EPE (Early Power Estimator) can be used for pre-design power estimation, and the Quartus II PowerPlay power analyzer provides more accurate estimates after place-and-route.
6. What is the operating temperature range of EP4CE75F23C8N?
The EP4CE75F23C8N is a commercial-grade device with a temperature range of 0°C to 85°C (TJ).
7. Is EP4CE75F23C8N RoHS compliant?
Yes, the "N" suffix indicates that the EP4CE75F23C8N is lead-free and RoHS compliant.
8. What is the maximum operating frequency of EP4CE75F23C8N?
The EP4CE75F23C8N can operate at up to 472.5 MHz.
9. What are the alternative models for EP4CE75F23C8N?
Alternatives to the EP4CE75F23C8N in the same series include EP4CE75F23C8 (non-RoHS compliant, leaded version), EP4CE75F23I7N (industrial temperature range, -40°C to 100°C), and EP4CE75F23C6 (higher speed grade), differing primarily in speed grade, temperature range, and RoHS compliance. Verify pinout and package compatibility before selection.
10. What configuration modes does EP4CE75F23C8N support?
Cyclone IV E devices like the EP4CE75F23C8N use SRAM cells to store configuration data that must be reloaded at each power-up. The EP4CE75F23C8N supports JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) configuration modes.