Item specifics
Description
HSEMSDY9S2B64G Product Overview
The HIKSEMI HSEMSDY9S2B64G is a 64GB eMMC flash storage chip, featuring a 153ball FBGA standard package. Established in 2017 as a subsidiary of Hikvision, HIKSEMI focuses on data centers, industrial control, automotive applications, smart security, and consumer electronics. The HSEMSDY9S2B64G is widely used in smartphones, dashcams, tablets, set-top boxes, smart TVs, and other consumer electronic devices. Leveraging HIKSEMI's full-stack self-developed capabilities from wafer packaging to module production, the HSEMSDY9S2B64G provides customers with stable and reliable embedded storage solutions.
HSEMSDY9S2B64G Key Features
Large Storage Capacity: The HSEMSDY9S2B64G provides 64GB storage capacity to meet the demands of operating systems, applications, and user data.
eMMC 5.1 Standard: The HSEMSDY9S2B64G complies with JEDEC eMMC 5.1 interface protocol with backward compatibility to eMMC 4.5. Sequential read speed of 160-270MB/s and sequential write speed of 70-210MB/s.
BGA153 Package: The HSEMSDY9S2B64G features a 153ball FBGA standard package with dimensions of 11.5×13×1mm.
Dual-Voltage Operation: The HSEMSDY9S2B64G supports VCC=2.7~3.6V and VCCQ=1.7~1.95V/2.7~3.6V.
Multiple Bus Widths: The HSEMSDY9S2B64G supports 1bit (default), 4bit, and 8bit data bus widths.
Industrial-Grade Temperature Range: The HSEMSDY9S2B64G offers an operating temperature of -25℃ to 85℃ for harsh environments.
Domestically Developed: HIKSEMI possesses full-stack self-developed capabilities from wafer packaging to module production, ensuring the quality of the HSEMSDY9S2B64G.
High Reliability: The HSEMSDY9S2B64G incorporates built-in high-reliability flash management mechanisms to ensure data integrity and storage lifespan.
HSEMSDY9S2B64G Applications
The HSEMSDY9S2B64G is widely used in the following fields:
Smartphones: The HSEMSDY9S2B64G serves as the main storage chip for mobile terminals
Dashcams: The HSEMSDY9S2B64G provides reliable storage for video data
Tablets: The HSEMSDY9S2B64G handles system and application storage
Set-Top Boxes: The HSEMSDY9S2B64G offers system storage for home entertainment devices
Smart TVs: The HSEMSDY9S2B64G provides operating system and application storage
Projectors: The HSEMSDY9S2B64G enables embedded storage solutions
Industrial Control: The HSEMSDY9S2B64G is used in embedded industrial control systems
Smart Security: The HSEMSDY9S2B64G delivers storage solutions for surveillance devices
HSEMSDY9S2B64G Key Advantages
Large Storage Capacity: The HSEMSDY9S2B64G offers 64GB capacity to meet the storage demands of mainstream smart devices, easily accommodating operating systems, various applications, and user data.
eMMC 5.1 High-Speed Standard: The HSEMSDY9S2B64G complies with the eMMC 5.1 mainstream specification, achieving sequential read speeds up to 270MB/s for excellent data transfer performance.
BGA153 Standard Package: The HSEMSDY9S2B64G comes in a 153ball FBGA standard package with compact 11.5×13×1mm dimensions, perfectly compatible with mainstream platforms.
Dual-Voltage Flexibility: The HSEMSDY9S2B64G supports VCC 2.7~3.6V and VCCQ dual-voltage modes, allowing flexible adaptation to different platform designs.
Full Industry Chain Self-Sufficiency: HIKSEMI, as a subsidiary of Hikvision, possesses full-stack self-developed capabilities from wafer packaging to module production, underpinning the quality of the HSEMSDY9S2B64G.
Diverse Application Scenarios: The HSEMSDY9S2B64G is widely used in smartphones, dashcams, tablets, set-top boxes, smart TVs, and other consumer electronic devices.
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FAQ
1. What is HSEMSDY9S2B64G?
The HSEMSDY9S2B64G is an eMMC storage chip from HIKSEMI. It integrates NAND flash and a controller into a single BGA package, providing a standardized storage solution for embedded systems.
2. What are the key specifications?
Key specifications are as follows:
Storage Capacity: 64GB
Flash Interface: eMMC 5.1
Sequential Read Speed: 160-270 MB/s
Sequential Write Speed: 70-210 MB/s
Operating Voltage: The HSEMSDY9S2B64G supports VCC=2.7~3.6V, VCCQ=1.7~1.95V/2.7~3.6V
Package: FBGA-153 (11.5x13mm)
3. What package does it use?
The HSEMSDY9S2B64G uses an FBGA-153 (Ball Grid Array) package. This is a 153-ball FBGA package, measuring 11.5mm × 13.0mm.
4. What applications is it suitable for?
The HSEMSDY9S2B64G is widely used in various embedded devices, including:
Smartphones and Tablets
Dashcams and Security Surveillance
Set-top boxes and Smart TVs
Industrial control and IoT devices
Projectors and other consumer electronics
5. What development tools support it?
As a standard eMMC storage chip, the HSEMSDY9S2B64G requires no dedicated software tools. Host platforms have built-in eMMC controller drivers, and the system can directly recognize and manage the HSEMSDY9S2B64G.
6. What is the operating temperature range?
HIKSEMI eMMC products like the HSEMSDY9S2B64G are typically available in different temperature grades:
Consumer Grade: -25°C to +85°C
Industrial/Automotive Grade: -40°C to +85°C
7. What are the key features?
High Integration: The HSEMSDY9S2B64G combines flash memory and controller in a single chip, simplifying system design
Standardized Interface: The HSEMSDY9S2B64G complies with JEDEC eMMC 5.1 standards, backward compatible with eMMC 4.5
High Reliability: The HSEMSDY9S2B64G leverages HIKVISION's technical accumulation in video, audio, imaging acquisition, and data management
Automotive Grade Option: Some models in the HSEMSDY9S2B64G family are AEC-Q100 certified and support wide-temperature operation
8. What interfaces does it support?
Host Interface: The HSEMSDY9S2B64G complies with the eMMC 5.1 standard protocol
Data Bus Width: The HSEMSDY9S2B64G supports 1-bit (default), 4-bit, and 8-bit
Package: 153-ball FBGA
9. What are the alternative models?
HIKSEMI same-series 64GB eMMC model: HSEMSDS7S2B64G
HIKSEMI same-series other capacities: HSEMSBS3S2B08G (8GB), HSEMSES2S2B16G (16GB), HSEMSDS6S2B32G (32GB), HSEMSDS7D2B128G (128GB)
Other brand compatible models: Can choose other brands' eMMC 5.1 64GB chips based on specific application scenarios, but the HSEMSDY9S2B64G offers a competitive edge.
10. What are the design considerations?
Pin Compatibility: For the HSEMSDY9S2B64G, BGA package pin definitions should be confirmed with the official datasheet
PCB Layout: High-speed signal traces require impedance matching and length control
Power Decoupling: Proper decoupling capacitors should be placed near VCC and VCCQ pins of the HSEMSDY9S2B64G
Voltage Selection: The HSEMSDY9S2B64G supports VCCQ at both 1.8V and 3.3V
Temperature Grade Confirmation: Select consumer, industrial, or automotive grade based on the application environment for the HSEMSDY9S2B64G