GD32F470IKH6 Product Overview
The GD32F470IKH6 is a flagship high-performance connectivity-line 32-bit general-purpose microcontroller from GigaDevice, based on the ARM Cortex-M4 core, in a BGA-176 package (10×10mm). Running at up to 240MHz, the GD32F470IKH6 features 3MB Flash and 256KB SRAM. As the flagship model in the GD32F470 connectivity line series, the GD32F470IKH6 offers exceptional performance, massive storage capacity, and 140 GPIOs, making it suitable for industrial control, motor drives, HMI, networking, and IoT applications. This GD32F470IKH6 is pin-compatible with the STM32F427/429 series and is a mainstream choice for high-performance domestic MCU substitution.
GD32F470IKH6 Core Features
GD32F470IKH6 Cortex-M4 Core with 240MHz Ultra-High Speed: Based on the ARM Cortex-M4 32-bit RISC core with FPU and DSP instruction set support. Running at up to 240MHz with zero-wait-state Flash access.
GD32F470IKH6 Massive Memory: The GD32F470IKH6 provides 3MB embedded Flash and 256KB SRAM.
GD32F470IKH6 140 GPIOs: 140 I/O ports.
High-Precision Analog Peripherals: 3×12-bit ADCs (24 channels) and 2×12-bit DACs.
Rich Communication Interfaces: 4×USART, 4×UART, 6×SPI, 3×I2C, 2×I2S, 2×CAN, USB 2.0 FS and HS (dual OTG), and Ethernet MAC.
Powerful Timer Resources: 8×16-bit general-purpose timers, 2×16-bit PWM advanced timers, 2×32-bit general-purpose timers, and 2×16-bit basic timers.
Advanced Peripherals: Digital Camera Interface (DCI) and External Memory Controller (EXMC) with SDRAM/SRAM/NOR/NAND extension support.
Wide Operating Voltage & Industrial Temperature: 2.6V~3.6V, -40℃ to +85℃.
BGA-176 Package with Highest I/O Density: BGA-176 package (10×10mm) provides 140 GPIOs, the highest I/O count in the GD32F470 series.
GD32F470IKH6 Applications
High-end industrial control & automation: PLCs, inverters, servo control, industrial robotics
Motor control & drives: BLDC motor control, FOC vector control, drone flight controllers
HMI & graphic display: Human-machine interfaces, TFT-LCD display driving
Networking: Ethernet gateways, protocol converters
Automotive electronics: In-vehicle CAN bus communication, car navigation
IoT & edge computing: IoT nodes, AIoT development platforms, data acquisition and processing
Medical devices: Medical monitoring and imaging equipment
Security & alarm systems: Security monitoring and alarm systems
GD32F470IKH6 Key Advantages
Domestic Flagship MCU, Perfect STM32F427/429 Alternative: A mainstream domestic alternative to the STM32F427/429 series. The GD32F470IKH6 is pin-compatible for direct hardware replacement.
240MHz Cortex-M4 Core for Industry-Leading Performance: Based on the ARM Cortex-M4 core running at up to 240MHz with FPU and DSP support. The GD32F470IKH6 achieves a 43% performance improvement over GD32F407 (168MHz).
3MB Massive Flash for Large Firmware: The GD32F470IKH6 offers 3MB embedded Flash, one of the largest capacities in the GD32F470 series.
140 GPIOs – BGA-176 Highest I/O Density: Compared to LQFP-100 (82 GPIOs) and LQFP-144 (112 GPIOs), the GD32F470IKH6's BGA-176 provides 140 GPIOs, the highest in the GD32F470 series.
High-Precision Analog Peripherals: 3×12-bit ADCs (24 channels) and 2×12-bit DACs.
Rich Communication & Advanced Peripherals: Ethernet MAC, USB 2.0 FS/HS (dual OTG), CAN, SDIO, DCI, and EXMC.
Mature Ecosystem for Rapid Development: The GD32F470IKH6 is pin-compatible with STM32F427/429 for direct hardware replacement. Supports Keil, IAR, GCC. Complete datasheets and development guides from GigaDevice.
Domestic Supply with Stable Availability: As an original GigaDevice product, the GD32F470IKH6 offers stable supply and a mature development ecosystem.
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FAQs:
1. What is GD32F470IKH6?
The GD32F470IKH6 is a flagship, high-performance 32-bit general-purpose MCU from GigaDevice, based on the Arm® Cortex®-M4 core. It is designed for demanding applications like industrial control and IoT, offering powerful computation, large memory, and a rich set of peripherals.
2. What are the key specifications of GD32F470IKH6?
Core & Frequency: Arm® Cortex®-M4 with FPU and DSP, up to 240MHz.
Memory: 3MB (3072KB) of Flash and 256KB of SRAM.
I/Os: Up to 140 I/O pins.
Operating Voltage: 2.6V to 3.6V.
Temperature Range: -40°C to +85°C.
3. What package does GD32F470IKH6 use?
It uses a BGA-176 (Ball Grid Array) package. This is a high-density, surface-mount package suitable for applications requiring a compact footprint and a high number of I/Os.
4. What applications is GD32F470IKH6 suitable for?
As a flagship model, it is ideal for industrial automation & robotics, IoT gateways, Human-Machine Interfaces (HMI), advanced motor drives, audio/video processing, and drone flight controllers – any application demanding high performance and complex connectivity.
5. What development tools support GD32F470IKH6?
Several mainstream tools are supported:
IDEs: Supports Keil MDK, IAR EWARM, GCC, Zephyr RTOS, and GigaDevice's official GD32 CubeIDE.
Debuggers/Programmers: Supports J-Link, GD-Link, and PEmicro.
6. What is the operating temperature range of GD32F470IKH6?
Its operating temperature range is -40°C to +85°C. This industrial-grade rating makes the GD32F470IKH6 suitable for harsh industrial and outdoor environments.
7. What are the key features of GD32F470IKH6?
High Performance: 240MHz Cortex-M4 core + FPU + DSP.
Large Memory: 3MB Flash + 256KB SRAM for complex code and data.
Rich Peripherals: Includes TFT-LCD controller, camera interface, and True Random Number Generator (TRNG).
Industrial-Grade: Wide voltage (2.6-3.6V) and temperature (-40-85°C) support.
8. What peripheral interfaces does GD32F470IKH6 support?
It boasts a comprehensive set of peripherals:
Communication: 8x U(S)ART, 6x SPI, 3x I2C, 2x CAN, 1x SDIO.
Networking & USB: 1x 10/100M Ethernet MAC, 1x USB 2.0 OTG (Full-Speed/High-Speed).
Graphics & Display: Supports TFT-LCD and Digital Camera Interface (DCI).
Analog: 3x 12-bit ADCs (24 channels) and 2x 12-bit DACs.
9. What are the alternative models for GD32F470IKH6?
Within the series:
GD32F470IIH6: BGA-176 package, but with 2MB of Flash.
GD32F470ZGT6: LQFP-144 package.
Other brands: Can be considered as a domestic alternative to high-performance MCUs like the STM32F407.
10. What are the design considerations when using GD32F470IKH6?
PCB Design: The BGA package requires more advanced PCB manufacturing and high-density routing.
Power Integrity: Ensure good decoupling for the multiple power and ground pins to maintain a stable 2.6-3.6V supply.
Software: Using GigaDevice's official GD32F4xx Standard Firmware Library is highly recommended to simplify development and avoid compatibility issues.
Evaluation: The official GD32F470I-EVAL board, which includes an onboard GD-Link debugger, serves as an excellent starting point for development and testing with the GD32F470IKH6.