Item specifics
Description
GD25Q64ESIGR Product Overview
The GD25Q64ESIGR is a 64Mbit (8MB) industrial-grade SPI NOR Flash memory chip from GigaDevice, housed in a SOP-8-208mil wide-body package (5.2mm width). The GD25Q64ESIGR supports standard SPI, dual SPI, and quad SPI interfaces with a maximum clock frequency of 133MHz, achieving data transfer rates up to 532Mbit/s in quad SPI mode. The GD25Q64ESIGR operates from 2.7V to 3.6V with a standby current of only 12µA and a deep power-down current of 1µA. With 100,000 program/erase cycles and 20 years of data retention, the GD25Q64ESIGR operates over an industrial temperature range of -40℃ to +85℃. The GD25Q64ESIGR features a 128-bit unique ID and security registers, making it widely used in embedded systems, industrial control, communication equipment, IoT, automotive electronics, and consumer electronics.
GD25Q64ESIGR Core Features
64Mbit Memory Capacity: The GD25Q64ESIGR provides 64Mbit (8MB) storage space, organized as 8M × 8.
SPI Quad Interface: The GD25Q64ESIGR supports standard SPI, dual SPI, and quad SPI interfaces. Quad I/O mode achieves data transfer rates up to 532Mbit/s.
133MHz High-Speed Clock: The GD25Q64ESIGR features a maximum clock frequency of 133MHz with an access time of only 7ns.
Wide Operating Voltage: 2.7V to 3.6V supply, compatible with 3.3V systems.
Ultra-Low Standby Current: Standby current of only 12µA, deep power-down current of 1µA.
High Reliability: 100,000 program/erase cycles with 20 years of data retention.
Multiple Write Protection Functions: Supports hardware write protection (WP# pin), software write protection, absolute write protection, and write enable latch.
Fast Program and Erase: Page programming time of 0.5ms (typical); 4KB sector erase time of 45ms (typical); 32KB block erase time of 150ms and 64KB block erase time of 250ms.
Advanced Security Features: 128-bit unique ID per device; SFDP (Serial Flash Discoverable Parameters) register; 3×1024-byte security registers with OTP locks.
XiP (eXecute In Place) Support: The GD25Q64ESIGR supports XiP operation with high-speed read reducing instruction fetch time, and continuous read mode further reducing data latency.
Wide Operating Temperature: Industrial temperature range of -40℃ to +85℃.
SOP-8-208mil Package: Wide-body 8-pin SOP package (208mil, 5.2mm width), offering wider pad spacing than standard SOP-8 (150mil, 3.9mm width), easier for hand-soldering and PCB routing.
GD25Q64ESIGR Applications
Embedded Systems: The GD25Q64ESIGR is ideal for firmware storage, bootloaders, and configuration files
Industrial Control & Automation: PLCs, industrial instruments, data acquisition equipment
Communication Equipment: Routers, switches, wireless modules, 5G base stations
IoT Devices: The GD25Q64ESIGR stores device parameters, network configurations, and sensor data
Automotive Electronics: In-vehicle infotainment, dashcams
Consumer Electronics & Portable Devices: Smart appliances, wearables, digital products
Smart Wearables & AMOLED Display Phones: Display configuration data storage. The GD25Q64ESIGR is a versatile choice for these applications.
GD25Q64ESIGR Key Advantages
GigaDevice Original Quality with Stable Supply: The GD25Q64ESIGR is a classic SPI NOR Flash product from GigaDevice, offering stable supply as a domestic solution. It has passed QVL verification on Espressif ESP32 series modules.
133MHz High-Speed Quad SPI for XiP Performance: Up to 133MHz clock frequency with quad SPI interface delivers data transfer rates up to 532Mbit/s. 7ns access time and continuous read mode reduce instruction fetch latency for XiP (eXecute In Place) applications.
Ultra-Low Power and Industrial Wide Temperature: The GD25Q64ESIGR features a standby current of only 12µA and a deep power-down current of 1µA. Operating temperature -40℃ to +85℃, storage temperature -65℃ to 150℃.
Multiple Write Protections for Data Integrity: Hardware write protection (WP# pin), software write protection, absolute write protection, and write enable latch. Low-voltage lockout automatically prevents write operations below 1.5V~2.5V threshold.
High Reliability and Long Lifespan: The GD25Q64ESIGR offers 100,000 program/erase cycles with 20 years of data retention.
Advanced Security Features: The GD25Q64ESIGR includes a 128-bit unique ID per device, SFDP register, and 3×1024-byte security registers with OTP locks.
SOP-8-208mil Wide-Body Package: SOP-8-208mil wide-body package (5.2mm width) offers wider pad spacing than standard SOP-8 (150mil, 3.9mm width), easier for hand-soldering and PCB routing.
Strong Compatibility: Compatible with equivalent products from Winbond and Macronix, verified on Espressif ESP32 series modules, adaptable to various mainstream MCU and SoC platforms.
Why Choose QIXINWEI
Years of experience in the electronics industry. Trusted by global customers.
Massive In-Stock Inventory – Ready to ship promptly
BOM Matching Service – One-stop solution, save time
PCBA Customization – Professional engineering team creates tailor-made solutions based on your needs
Cost-Effective & Efficient – Better channel, better cost
A dedicated team makes your procurement smoother.
Contact us for BOM quotes or PCBA inquiries
FAQ
1. What is GD25Q64ESIGR?
GD25Q64ESIGR is a 64Mbit (8MB) industrial-grade SPI NOR Flash memory from GigaDevice. It supports standard SPI, dual SPI, and quad SPI interfaces, making it a widely used general-purpose storage chip in embedded systems due to its balanced electrical performance, rich features, and stable operation.
2. What are the key specifications of GD25Q64ESIGR?
Memory Size: 64Mbit (8M × 8)
Clock Frequency: Up to 133MHz
Access Time: 7ns
Interface: SPI (Standard/Dual/Quad)
Supply Voltage: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ +85°C (industrial grade)
Standby Current: 12µA typical
Deep Power-Down Current: 1µA typical
Endurance: 100,000 program/erase cycles minimum
Data Retention: 20 years typical
3. What package does GD25Q64ESIGR use?
It uses an SOP-8-208mil package (8-SOIC, 0.209"/5.30mm width). Standard packaging is 2000 pieces per reel (Tape & Reel) . Moisture Sensitivity Level is MSL 3 (168 hours).
4. What applications is GD25Q64ESIGR suitable for?
The GD25Q64ESIGR is widely used in communication equipment, industrial automation control, consumer electronics and portable devices, smart wearables, AMOLED camera modules, IoT devices, automotive electronics, and 5G base stations. It also supports XIP (eXecute In Place) operation for systems that execute code directly from Flash.
5. What development tools support GD25Q64ESIGR?
As a standard SPI NOR Flash chip, no dedicated software tools are required for the GD25Q64ESIGR. Designers can refer to the GD25Q64E series datasheet available on the GigaDevice website. SPI drivers from mainstream MCU vendors (e.g., ST, GD32) support this device. Some FPGA vendors (e.g., Elitest) also provide official support for GD25 series Flash.
6. What is the operating temperature range of GD25Q64ESIGR?
The operating temperature range of the GD25Q64ESIGR is -40°C to +85°C (ambient temperature TA). The storage temperature range is -65°C to +150°C. This industrial-grade device is suitable for harsh environments.
7. What are the key features of GD25Q64ESIGR?
High-speed quad SPI interface: Quad I/O data transfer up to 532Mbit/s
XIP (eXecute-In-Place) support: Allows code execution directly from Flash, reducing instruction fetch time
Multiple write protection mechanisms: Hardware write protection, software write protection, write enable latch, absolute write protection
Low power consumption: Standby current as low as 12µA, deep power-down mode as low as 1µA
High reliability: 100,000 erase/write cycles + 20-year data retention
Advanced security features: The GD25Q64ESIGR features a 128-bit Unique ID for each device
Flexible architecture: 4KB sectors, 32/64KB blocks
8. What interfaces and transfer rates does GD25Q64ESIGR support?
Standard SPI: SCLK, CS#, SI, SO
Dual SPI: SCLK, CS#, IO0, IO1, transfer rate 266Mbit/s
Quad SPI: SCLK, CS#, IO0~IO3, transfer rate 532Mbit/s
Operation Timing (typical) : Page Program 0.5ms, Sector Erase (4KB) 45ms, Block Erase (64KB) 0.25s, Chip Erase 25s
9. What are the alternative models for GD25Q64ESIGR?
Alternatives in the same series include GD25Q64EWIGR, GD25Q64CSIGR, and GD25Q64CWIGR. This device can also replace equivalent models from Winbond and Macronix. For larger capacity, GD25Q128ESIGR (128Mbit) is available.
10. What are the design considerations when using GD25Q64ESIGR?
Power decoupling: Place a 0.1µF ceramic capacitor near the VCC pin for stable power
Pull-up resistors: Add 10kΩ pull-up resistors on CS, SCLK, and MOSI lines
WP# and HOLD# pins: Tie to VCC (high) if not used — do not leave floating
Quad SPI mode: Must be configured via the status register; default is standard SPI mode
Low-voltage protection: Write operations are automatically locked when supply voltage drops below the 1.5V~2.5V threshold
PCB layout: SOP-8-208mil package (5.30mm width) is suitable for hand soldering and reflow soldering