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ESP32-S3FN8 Product Overview
The ESP32-S3FN8 is a high-performance, low-power Wi-Fi + Bluetooth 5.0 dual-mode wireless MCU SoC from Espressif Systems, featuring an Xtensa® 32-bit LX7 dual-core processor running at up to 240MHz. Housed in a QFN-56-EP (7×7mm) package, the chip integrates 8MB Quad SPI in-package Flash. The ESP32-S3FN8 features 512KB SRAM and 384KB ROM, supporting 2.4GHz Wi-Fi (802.11 b/g/n, 1T1R, up to 150Mbps) and Bluetooth 5 (LE) dual-mode wireless communication. The chip provides 45 programmable GPIOs, integrates rich peripheral interfaces and comprehensive hardware security mechanisms (AES, SHA, RSA accelerators, RNG, Secure Boot, Flash Encryption). The ESP32-S3FN8 is widely used in smart home, industrial automation, healthcare, wearables, and smart agriculture IoT and embedded applications.
ESP32-S3FN8 Key Features
The ESP32-S3FN8 is powered by the Xtensa® 32-bit LX7 dual-core processor running at up to 240MHz. CoreMark® scores reach 613.86 for single-core and 1181.60 for dual-core. The 128-bit data bus width and SIMD instructions provide hardware acceleration for AI inference and digital signal processing. An integrated single-precision FPU handles complex mathematical operations. An ultra-low-power coprocessor (ULP-RISC-V and ULP-FSM) runs low-power tasks in Deep-sleep mode. On-chip memory includes 384KB ROM, 512KB SRAM, and 16KB RTC SRAM.
The ESP32-S3FN8 integrates 8MB Quad SPI in-package Flash. With Flash directly封装 inside the chip, no external Flash chip is required, saving PCB area, simplifying hardware design, and reducing BOM cost and supply chain complexity.
2.4GHz Wi-Fi + Bluetooth 5.0 Dual-Mode Wireless: ESP32-S3FN8 supports IEEE 802.11b/g/n with 20MHz and 40MHz bandwidth in the 2.4GHz band, 1T1R mode with data rates up to 150Mbps. Supports Station, SoftAP, and Station+SoftAP modes. Bluetooth 5 LE supports 125Kbps, 500Kbps, 1Mbps, and 2Mbps rates, with Advertising Extensions, Multiple Advertisement Sets, and Bluetooth mesh. Wi-Fi and Bluetooth share the same antenna with a built-in coexistence mechanism.
The ESP32-S3FN8 provides 45 programmable GPIOs, supporting SPI, I2C, I2S, UART, USB OTG, LED PWM, MCPWM, RMT, LCD Interface, Camera Interface, SD/MMC Host, TWAI® (CAN 2.0) , and more. Integrated 2×12-bit SAR ADCs, a temperature sensor, and 14 touch-sensing input pins.
The ESP32-S3FN8 integrates AES, SHA, and RSA hardware accelerators, True Random Number Generator (RNG) , HMAC, and Digital Signature modules. Supports Secure Boot and Flash Encryption, providing hardware-level security for IoT devices.
The ESP32-S3FN8 supports Active, Modem-sleep, Light-sleep, and Deep-sleep power modes. Operating voltage range is 3V ~ 3.6V, and operating temperature range is -40℃ ~ +85℃.
ESP32-S3FN8 Applications
With its powerful dual-core processing, 8MB in-package Flash, and dual-mode wireless connectivity, the ESP32-S3FN8 is widely used in:
ESP32-S3FN8 is used in Smart Home & Smart Appliances
ESP32-S3FN8 is applied in Industrial Automation & Control
ESP32-S3FN8 is suitable for Healthcare Devices
ESP32-S3FN8 is found in Wearable Devices
ESP32-S3FN8 supports Consumer Electronics
ESP32-S3FN8 enables Smart Agriculture
ESP32-S3FN8 is used in IoT Nodes & Edge Computing
ESP32-S3FN8 supports Education & Prototyping
ESP32-S3FN8 Advantages and Highlights
The ESP32-S3FN8 is a highly cost-effective dual-core Wi-Fi + Bluetooth SoC solution from Espressif for high-value, highly integrated IoT connectivity applications. Its core advantage lies in the single-chip integration of the Xtensa LX7 dual-core processor, Wi-Fi, Bluetooth 5.0, and 8MB in-package Flash, providing developers with a streamlined, efficient, and high-performance wireless connectivity platform.
8MB In-Package Flash, Simplified PCB Design: The ESP32-S3FN8 integrates 8MB Flash directly inside the chip package, eliminating the need for an external Flash chip. This saves PCB area, simplifies hardware design, and reduces BOM cost and supply chain complexity — especially suitable for space-constrained compact product designs.
Xtensa LX7 Dual-Core 240MHz, CoreMark Over 1100: ESP32-S3FN8's dual-core LX7 processor achieves a CoreMark score of 1181.60 at 240MHz. The 128-bit data bus width and SIMD instructions provide hardware acceleration for AI workloads and signal processing. The single-precision FPU enables efficient floating-point and complex mathematical computations.
Dual-Mode Wireless + Bluetooth 5.0 for Diverse Connectivity: ESP32-S3FN8 supports 2.4GHz Wi-Fi (802.11 b/g/n, up to 150Mbps) and Bluetooth 5 (LE) dual-mode communication. ESP32-S3FN8's Bluetooth 5.0 supports 2Mbps high-speed data, advertising extensions, and Bluetooth mesh, making it suitable for large-scale IoT networking. The Wi-Fi and Bluetooth coexistence mechanism ensures stable simultaneous operation.
45 GPIOs and Rich Peripheral Interfaces: ESP32-S3FN8's QFN-56 package provides 45 programmable GPIOs, supporting SPI, I2C, I2S, UART, USB OTG, LCD Interface, Camera Interface, and more. 14 touch-sensing input pins support capacitive touch interaction.
Industrial-Grade Wide Temperature Range: With an operating temperature range of -40℃ ~ +85℃, the ESP32-S3FN8 meets industrial-grade requirements and adapts to harsh environments.
Comprehensive Hardware Security: ESP32-S3FN8 integrates AES, SHA, and RSA hardware accelerators, True Random Number Generator (RNG) , HMAC, and Digital Signature modules. Supports Secure Boot and Flash Encryption, providing hardware-level security for IoT devices.
Mature Software Ecosystem: Espressif provides a complete ESP-IDF development framework, with support for Arduino IDE and MicroPython. ESP-IDF includes rich APIs, example code, and debugging tools, significantly lowering the development barrier and accelerating time-to-market.
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FAQs:
Question: What is the difference between the ESP32-S3FN8 and ESP32-S3R8?
Answer: The key difference lies in on-package memory. The FN8 model integrates 8MB Flash but no PSRAM. The R8 model integrates 8MB PSRAM but no Flash (external Flash is required). The FN8 occupies less PCB area than versions requiring an external Flash.
Question: What is the processing performance?
Answer: ESP32-S3FN8 features a dual-core Xtensa LX7 processor running up to 240MHz. It scores around 1181.60 CoreMark when both cores run at 240MHz.
Question: What analog and sensing capabilities are built in?
Answer: ESP32-S3FN8 integrates 2x 12-bit SAR ADCs (up to 20 channels), 1x temperature sensor, and 14x capacitive touch-sensing GPIOs.
Question: Which development environments are supported?
Answer: ESP32-S3FN8 supports Espressif's official ESP-IDF framework, along with Arduino IDE and MicroPython environments.
Question: What wireless protocols does it support?
Answer: ESP32-S3FN8 supports IEEE 802.11b/g/n Wi-Fi (up to 150Mbps) and Bluetooth 5 (LE), including Bluetooth Mesh networking.
Question: What package and physical dimensions does it use?
Answer: ESP32-S3FN8 uses a QFN-56 package (with exposed thermal pad) measuring 7.0 x 7.0 mm.
Question: What are the operating voltage and temperature ranges?
Answer: For ESP32-S3FN8, the nominal operating voltage is 3.3V, and the industrial-grade temperature range covers -40℃ to +85℃.
Question: What are the design advantages over models without internal Flash?
Answer: ESP32-S3FN8 integrates 8MB Flash, making design simpler without external flash chips, saving BOM cost and reducing production risks associated with dropped or unsoldered Flash chips.
Question: Is it suitable for voice or image recognition AI projects?
Answer: Yes. ESP32-S3FN8 is a key member of the ESP32-S3 family featuring AI instruction extensions and a single-precision FPU, making it ideal for edge AI applications.
Question: What tools can be used for mass production programming?
Answer: ESP32-S3FN8 is supported by mainstream programmers (e.g., Acroview AP8000). Mass production can be achieved via Espressif's official production tools for batch flashing or OTA update.