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EP3SE80F780C4N Product Overview
The EP3SE80F780C4N is a high-performance FPGA from Altera (now Intel) in the Stratix III E series, manufactured on advanced 65nm CMOS process technology. The device features 80,000 Logic Elements (LEs), 3,200 Adaptive Logic Modules (LABs), 6,843,392 bits of embedded RAM, and 488 user I/O pins, operating at up to 717 MHz internally. This commercial grade (C grade) device supports 0°C to 85°C operating temperature range and comes in a 780-pin FC-FBGA package (29×29mm), offering a cost-effective mid-density option in the Stratix III series.
EP3SE80F780C4N Core Features
Logic Resources： 80,000 Logic Elements (LEs) and 3,200 Adaptive Logic Modules (LABs) providing ample high-density digital logic design capability
TriMatrix Embedded Memory： 6,843,392 total RAM bits (approx 6.8Mbit) comprising three RAM block sizes supporting true dual-port memory and FIFO buffers for memory-intensive applications
High Performance DSP： Integrated high-speed DSP blocks supporting 9x9, 12x12, 18x18, and 36x36 multipliers up to 550MHz for multiply-accumulate functions and FIR filters
I/O Interfaces： 488 user I/O pins with 8:1:1 I/O:GND:PWR ratio, featuring On-Chip Termination (OCT) with auto calibration for excellent signal integrity
Maximum Frequency： Internal logic operating up to 717 MHz meeting high performance timing requirements
Programmable Power Technology： Dynamic power management with selectable lowest power or highest performance operation modes
Clock Management： Up to 12 phase-locked loops (PLLs) supporting PLL reconfiguration, clock switchover, programmable bandwidth, clock synthesis, and dynamic phase shifting
High Speed Differential I/O： Up to 1.6 Gbps differential I/O performance with integrated SERDES and Dynamic Phase Alignment (DPA) circuitry
External Memory Interfaces： Supports high-speed external memories including DDR, DDR2, DDR3 SDRAM, RLDRAM II, QDR II, and QDR II+ SRAM
Security Features： Industry's first high-density high-performance FPGA supporting 256-bit AES encryption with volatile and non-volatile security key for design IP protection
Process Technology： 65nm CMOS process with 1.2V to 3.3V multi-voltage I/O support and 0.86V to 0.94V core voltage
Package Type： 780-pin FC-FBGA (29×29mm) with 1.0mm ball pitch, lead free RoHS compliant
Built-in ECC： Integrated Error Correction Coding circuitry to detect and correct data errors in M144K TriMatrix memory blocks
Integrated CRC： Configuration memory error detection CRC with critical error determination for high availability systems
Hot Socketing Support： Robust on-chip hot socketing and power sequencing support
EP3SE80F780C4N Applications
Communications Infrastructure： Wireless base station nodes, core routers, network switches, protocol conversion, SPI-4.2, SFI-4, and 10 Gigabit Ethernet XSBI interfaces
High Performance Computing： Data center acceleration, high performance computing platforms, ASIC prototyping, massively parallel processing systems
Military and Aerospace： Radar signal processing, electronic warfare systems, high reliability embedded platforms
Medical Imaging Systems： Ultrasound beamforming, CT image reconstruction, high throughput signal processing chains
Industrial Automation： Advanced robotics control, factory automation systems, PLC controllers, industrial vision systems
Video and Image Processing： Multi-channel HD video codec, image scaling, object recognition algorithms
Telecom and Networking： Supports high-speed communication bus standards including RapidIO and NPSI
Automotive Electronics： Advanced Driver Assistance Systems (ADAS), in-vehicle computing platforms
EP3SE80F780C4N Key Advantages
Cost-Effective Mid-Density FPGA： 80K logic elements offer balanced price-performance ratio for moderate complexity designs, with pricing available as low as $206.10 through some channels
65nm Advanced Process： 65nm CMOS technology provides higher logic density and lower power compared to 90nm predecessors
TriMatrix Memory Architecture： Industry leading TriMatrix memory with three RAM block sizes totaling 6.8Mbits for memory-intensive applications
High Performance DSP Processing： DSP blocks and multipliers up to 550MHz for high-performance filters and digital signal processing
Rich Clock Management： Up to 12 PLLs providing complete clock management solutions including reconfiguration, clock switchover, and dynamic phase shifting
High Speed Differential Signal Support： Up to 1.6Gbps differential I/O with integrated SERDES and DPA circuitry for backplane communication and high-speed ADC/DAC data acquisition
Comprehensive Memory Interface Support： Supports DDR/DDR2/DDR3 SDRAM, RLDRAM II, QDR II, and other high-speed external memories
Strong Security Features： 256-bit AES encryption for design IP protection, unique among high-density high-performance FPGAs at its time
High Reliability Design： On-chip CRC and ECC circuitry ensures configuration data and memory data integrity for high availability systems
Comprehensive Design Tool Support： Quartus II software with complete development environment and Nios II embedded processor support
Rich IP Ecosystem： Supports multiple intellectual property cores including SPI-4.2 and RapidIO through Altera MegaCore functions and AMPPSM program
Lead Free Environmentally Friendly Package： RoHS compliant lead free process meeting environmental compliance requirements
Stable Supply Chain： Although obsolete, abundant global inventory supports equipment maintenance and long life project procurement
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FAQ:
What is the EP3SE80F780C4N and its key specifications?
This is a high‑performance Altera Stratix III E FPGA built on a 65 nm low‑power process. It provides 80,000 logic elements (LEs), approximately 6.2 Mbits of embedded block RAM, and 288 18×18 multiplier blocks. The device includes 4 general‑purpose PLLs and offers up to 488 user I/O pins in a 780‑pin FineLine BGA (FBGA780) package. It operates from a 1.1 V core supply, and the “C4” suffix indicates a commercial temperature range (0 °C to +85 °C) with the speed grade 4 (the slowest grade in the Stratix III family, yet still capable of over 300 MHz system performance). As a member of the Stratix III E (Enhanced) family, it is optimised for logic‑intensive and DSP‑rich applications, without the high‑speed transceivers found in the GX series.
How does the EP3SE80 compare to the EP3SE50 or EP3SE110 in the Stratix III E series?
All three are pin‑compatible in the same package. The main difference is logic density and DSP/memory resources. The EP3SE50 offers 47,500 LEs and 216 multipliers; the EP3SE80 steps up to 80,000 LEs and 288 multipliers; the EP3SE110 provides 107,500 LEs and 384 multipliers. They share the same I/O count, PLLs, and memory architecture (the larger devices have more block RAM). This makes migration straightforward — you can start with the SE50 and move to the SE80 or SE110 if you need more logic or DSP without changing your board layout.
How many I/O pins does the FBGA780 package provide, and what standards are supported?
The FBGA780 package delivers up to 488 user I/O pins. These I/Os are organized in banks that can independently support a large set of single‑ended and differential standards: LVTTL, LVCMOS (1.2 V–3.3 V), SSTL, HSTL, LVDS, RSDS, mini‑LVDS, and LVPECL. Each I/O features programmable drive strength, slew rate, and on‑chip termination (OCT). This high I/O count and flexibility make the device ideal for interfacing with DDR2/DDR3 memories, parallel buses, and high‑speed LVDS links without external termination resistors.
What block RAM and DSP resources are available on the EP3SE80?
The EP3SE80 contains 6.2 Mbits of embedded block RAM, configured as a mix of M9K and M144K memory blocks. These support true dual‑port operation, FIFO modes, and error‑correction coding (ECC). For digital signal processing, it includes 288 dedicated 18×18 multipliers that can be cascaded or used independently. Together with the logic fabric, this enables complex FIR filters, FFTs, and video processing pipelines without external hardware.
What does the “C4” speed grade and temperature designation mean?
The “C” indicates a commercial temperature range of 0 °C to +85 °C. The “4” is the speed grade, where a lower number represents a slower device in Altera’s numbering (C4 is the slowest for this family, C3 is faster, C2 is the fastest industrial‑grade option). Even at the C4 grade, the EP3SE80 can comfortably achieve system clock speeds above 300 MHz in well‑optimised designs. For applications requiring higher timing margins or industrial temperature ranges, the faster ‑3 or ‑2 grades (with “I” temperature suffix) are available.
How is the EP3SE80 configured and programmed? What development tools are needed?
Configuration is stored in an external non‑volatile memory — typically a MAX II CPLD, an EPCQ flash device, or a standard SPI flash. The FPGA loads its bitstream at power‑up via Fast Passive Parallel (FPP), Active Serial (AS), or JTAG interfaces. Design and debugging are performed with Intel Quartus Prime Standard Edition (the free Lite edition does not support Stratix III; a paid license or the older Quartus II subscription edition is required). A USB‑Blaster download cable is used for programming. The built‑in SignalTap II logic analyzer allows real‑time debugging of internal nodes.
What is the typical power consumption of the EP3SE80? Does it require a heatsink?
Static power is typically under 1 W, and dynamic power scales with design utilization and clock frequency. A typical design may consume between 2 W and 8 W. The 65 nm low‑power process and Programmable Power Technology (where individual tiles can be set to high‑speed or low‑power mode) help optimise power. For sustained high‑load operation, a small heatsink and airflow are recommended, but many designs can run without forced cooling if the toggle rate is moderate.
How does the Stratix III E compare to the Cyclone IV E or Stratix IV families?
The Cyclone IV E (60 nm) is a low‑cost, lower‑density family with fewer LEs, smaller block RAM, and no high‑speed transceivers. The Stratix III E offers significantly more logic, higher memory bandwidth, and more DSP blocks, making it suitable for complex processing. The Stratix IV GX/E (40 nm) improves on Stratix III with higher logic density, faster transceivers, and lower power. However, Stratix III remains a proven, reliable choice for existing designs, military/aerospace applications, and systems that require a mature 65 nm node with excellent signal integrity and a long lifecycle.
What is the package size and ball pitch of the FBGA780? Is it suitable for prototyping?
The FBGA780 package measures 29 mm × 29 mm with a 1.0 mm ball pitch. The 1.0 mm pitch is relatively large for a BGA and allows easier fan‑out on standard PCB technology. While it is not as hand‑solderable as a QFP, it is well‑suited for professional assembly and can be prototyped with a hot‑air station for small‑scale work. The package provides a generous I/O count without requiring HDI (high‑density interconnect) techniques.
What are the most typical applications for the EP3SE80F780C4N?
This FPGA is widely used in high‑performance digital signal processing (radar, software‑defined radio), broadcast video processing, medical imaging, military and aerospace systems, test and measurement equipment, and industrial motor controllers. Its combination of 80K logic elements, 488 I/Os, 288 multipliers, and abundant memory makes it a powerful platform for data‑intensive parallel processing and complex algorithmic acceleration.